锗异质外延中基于器件的螺纹位错评估

E. Simoen, C. Claeys, A. Oliveira, P. Agopian, J. Martino, B. Hsu, G. Eneman, E. Rosseel, R. Loo, H. Arimura, N. Horiguchi, Wei-Chen Wen, H. Nakashima
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引用次数: 3

摘要

本文报道了锗异质外延层中扩展缺陷的电活动,更具体地说,是螺纹位错。重点是一些基本类型的器件的影响,如p-n结二极管,金属氧化物半导体(MOS)电容器和用锗硅制造的翅片场效应晶体管(FinFET)。将显示对p-n二极管泄漏电流和寿命的影响的良好理解。Ge MOScaps上的深能级瞬态光谱可以研究与螺纹位错相关的体态和界面态。最后,将说明产生复合(GR)噪声光谱在应变和松弛Ge-on- si finfet中GR中心研究中的应用。
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Device-Based Threading Dislocation Assessment in Germanium Hetero-Epitaxy
A review on the electrical activity of extended defects and, more specifically, threading dislocations in germanium hetero-epitaxial layers is reported here. Focus is on the impact of some basic types of devices, like a p-n junction diode, a Metal-Oxide-Semiconductor (MOS) capacitor and a Fin-Field-Effect Transistor (FinFET) fabricated in Ge-on-Si. A good understanding of the impact on the leakage current and lifetime in p-n diodes will be shown. Deep-Level Transient Spectroscopy on Ge MOScaps enables the investigation of bulk and interface states related to threading dislocations Finally, the application of Generation-Recombination (GR) noise spectroscopy to the study of GR centers in strained and relaxed Ge-on-Si FinFETs will be illustrated.
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