Marco Cignoli, Gabriele Minoia, M. Repossi, D. Baldi, A. Ghilioni, E. Temporiti, F. Svelto
{"title":"22.9一种1310nm 3d集成硅光子mach - zehnder发射机,具有275mW多级CMOS驱动器,在25Gb/s下实现6dB消光比","authors":"Marco Cignoli, Gabriele Minoia, M. Repossi, D. Baldi, A. Ghilioni, E. Temporiti, F. Svelto","doi":"10.1109/ISSCC.2015.7063103","DOIUrl":null,"url":null,"abstract":"In this scenario, this work presents a complete 25Gb/s silicon photonics electro-optical transmitter front-end comprising an MZM, using carrier depletion P-N junctions and operating at 1310nm wavelength, and a power-efficient CMOS driver. The transmitter optical path is integrated on STMicroelectronics 3Dcompatible silicon-photonics platform (PIC25G), which implements only optical devices in the front-end of line (FEOL) [4]. The electronic IC, realized in 65nm bulk CMOS technology, is 3D-assembled on top of the photonic IC by means of 20μm-diameter copper pillars, minimizing the interconnection parasitic capacitance. This 1310nm 25Gb/s silicon photonics electro-optical transmitter reports error-free operation with wide open optical eye diagrams at a competitive dynamic extinction ratio (ER) of up to 6dB using a depletion-mode MZM.","PeriodicalId":188403,"journal":{"name":"2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers","volume":"137 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"41","resultStr":"{\"title\":\"22.9 A 1310nm 3D-integrated silicon photonics Mach-Zehnder-based transmitter with 275mW multistage CMOS driver achieving 6dB extinction ratio at 25Gb/s\",\"authors\":\"Marco Cignoli, Gabriele Minoia, M. Repossi, D. Baldi, A. Ghilioni, E. Temporiti, F. Svelto\",\"doi\":\"10.1109/ISSCC.2015.7063103\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this scenario, this work presents a complete 25Gb/s silicon photonics electro-optical transmitter front-end comprising an MZM, using carrier depletion P-N junctions and operating at 1310nm wavelength, and a power-efficient CMOS driver. The transmitter optical path is integrated on STMicroelectronics 3Dcompatible silicon-photonics platform (PIC25G), which implements only optical devices in the front-end of line (FEOL) [4]. The electronic IC, realized in 65nm bulk CMOS technology, is 3D-assembled on top of the photonic IC by means of 20μm-diameter copper pillars, minimizing the interconnection parasitic capacitance. This 1310nm 25Gb/s silicon photonics electro-optical transmitter reports error-free operation with wide open optical eye diagrams at a competitive dynamic extinction ratio (ER) of up to 6dB using a depletion-mode MZM.\",\"PeriodicalId\":188403,\"journal\":{\"name\":\"2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers\",\"volume\":\"137 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-03-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"41\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.2015.7063103\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2015.7063103","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
22.9 A 1310nm 3D-integrated silicon photonics Mach-Zehnder-based transmitter with 275mW multistage CMOS driver achieving 6dB extinction ratio at 25Gb/s
In this scenario, this work presents a complete 25Gb/s silicon photonics electro-optical transmitter front-end comprising an MZM, using carrier depletion P-N junctions and operating at 1310nm wavelength, and a power-efficient CMOS driver. The transmitter optical path is integrated on STMicroelectronics 3Dcompatible silicon-photonics platform (PIC25G), which implements only optical devices in the front-end of line (FEOL) [4]. The electronic IC, realized in 65nm bulk CMOS technology, is 3D-assembled on top of the photonic IC by means of 20μm-diameter copper pillars, minimizing the interconnection parasitic capacitance. This 1310nm 25Gb/s silicon photonics electro-optical transmitter reports error-free operation with wide open optical eye diagrams at a competitive dynamic extinction ratio (ER) of up to 6dB using a depletion-mode MZM.