低成本和高度集成的射频前端模块的技术开拓者

2014 IEEE International Electron Devices Meeting Pub Date : 2014-12-01 DOI:10.1109/IEDM.2014.7047077

C. Raynaud

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摘要

本文的重点是强调与移动设备中越来越多的模式(GSM, WCDMA, LTE…)和频带相关的挑战。介绍了低成本高集成度多模多频带射频前端模块的技术先行者。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Technology pathfinders for low cost and highly integrated RF Front End modules

The focus of this paper is to highlight the challenges related to the increasing number of modes (GSM, WCDMA, LTE..) and frequency bands in mobile devices. It describes the technology pathfinders to get cheaper highly integrated multi-mode multi-band RF Front End modules.

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2014 IEEE International Electron Devices Meeting

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