从门侧氢释放的角度看神秘的双极偏置温度应力

T. Grasser, B. Kaczer, B. O’Sullivan, G. Rzepa, B. Stampfer, M. Waltl
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引用次数: 8

摘要

半个多世纪以来,偏置温度的不稳定性给材料带来了许多难题,而双极(+Vg/-Vg)交流应力比直流或单极(Vg/0)交流NBTI/PBTI的组合更容易导致材料的退化,这一发现尤其令人费解。有趣的是,氧化物分解和热载流子注入也有类似的观察结果。两者都与在交替的正负偏压下加速氢从氧化物中释放有关,从而导致近界面状态的产生。基于这些观察结果,我们从最近提出的BTI门侧氢释放模型的角度来研究这一现象。我们提出了一种机制,可以解释在双极交流应力下观察到的加速降解,并研究和验证了通过减少H释放的氧化物体积来减轻影响的可能性。
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The Mysterious Bipolar Bias Temperature Stress from the Perspective of Gate-Sided Hydrogen Release
While the bias temperature instability has provided many puzzles for more than half a century, the observation that bipolar (+Vg/-Vg) AC stress can lead to larger degradation than DC or unipolar (Vg/0) AC NBTI/PBTI combined, is particularly mysterious. Interestingly, similar observations have been made for oxide breakdown and hot carrier injection. Both have been linked to accelerated hydrogen release from the oxide under alternating positive and negative bias which then causes the creation of near-interface states. Based on these observations, we investigate the phenomenon from the perspective of the recently proposed gate-sided hydrogen release model for BTI. We suggest a mechanism which can explain the accelerated degradation observed during bipolar AC stress and investigate and validate possibilities for mitigating the effect by reducing the oxide volume from which H is released.
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