O. Patterson, MD Golam Faruk, Datong Zhang, Guanchen He, B. Sheumaker
{"title":"接触层负模电子束检测","authors":"O. Patterson, MD Golam Faruk, Datong Zhang, Guanchen He, B. Sheumaker","doi":"10.1109/asmc54647.2022.9792528","DOIUrl":null,"url":null,"abstract":"Contact CMP is one of the most popular layers for application of e-beam inspection. Using voltage contrast, contact opens and shorts may uniquely be detected. Generally positive surface charging (positive mode) is used, but negative surface charging (negative mode) provides a number of noteworthy advantages, including throughput, which are highlighted in this paper. Usually, adjustment of the landing energy or electric field is used to shift a wafer image into negative mode. This paper introduces and demonstrates a new control knob, beam density.","PeriodicalId":436890,"journal":{"name":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Negative Mode E-Beam Inspection of the Contact Layer\",\"authors\":\"O. Patterson, MD Golam Faruk, Datong Zhang, Guanchen He, B. Sheumaker\",\"doi\":\"10.1109/asmc54647.2022.9792528\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Contact CMP is one of the most popular layers for application of e-beam inspection. Using voltage contrast, contact opens and shorts may uniquely be detected. Generally positive surface charging (positive mode) is used, but negative surface charging (negative mode) provides a number of noteworthy advantages, including throughput, which are highlighted in this paper. Usually, adjustment of the landing energy or electric field is used to shift a wafer image into negative mode. This paper introduces and demonstrates a new control knob, beam density.\",\"PeriodicalId\":436890,\"journal\":{\"name\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"47 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/asmc54647.2022.9792528\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asmc54647.2022.9792528","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Negative Mode E-Beam Inspection of the Contact Layer
Contact CMP is one of the most popular layers for application of e-beam inspection. Using voltage contrast, contact opens and shorts may uniquely be detected. Generally positive surface charging (positive mode) is used, but negative surface charging (negative mode) provides a number of noteworthy advantages, including throughput, which are highlighted in this paper. Usually, adjustment of the landing energy or electric field is used to shift a wafer image into negative mode. This paper introduces and demonstrates a new control knob, beam density.
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