Yoshiyuki Takasu, K. Kikuchi, H. Nakagawa, K. Koshiji, M. Aoyagi
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Simulated high-frequency characteristics of coaxial via connection structures in printed circuit boards using three-dimensional electromagnetic field analysis
High-speed signal transmission of over 10 Gbps is required even for the signal transmission line of printed circuit boards (PCBs). To realize high-speed signal transmission, we developed a PCB technology with a rectangular coaxial line structure. The coaxial line structure is suitable for high-speed signal transmission because of its realization of precise characteristic impedance control and low crosstalk. In this paper, we report the high-frequency characteristics of coaxial bend and via structures in comparison with those of a microstrip-line structure obtained using a three-dimensional electromagnetic field simulation.
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