铜动力金属化学镀镍过程中铜活化过程中钯铜相互扩散

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2014-06-01 DOI:10.1109/IPFA.2014.6898185

Poo Khai Yee, Wan Tatt Wai, Yong Foo Khong

{"title":"铜动力金属化学镀镍过程中铜活化过程中钯铜相互扩散","authors":"Poo Khai Yee, Wan Tatt Wai, Yong Foo Khong","doi":"10.1109/IPFA.2014.6898185","DOIUrl":null,"url":null,"abstract":"Electroless Nickel deposition on Copper metallization required a thin Palladium layer (<; 5nm) as catalyst for Copper activation purpose. By using several physical failure analysis approaches, Palladium-Copper inter-diffusion behavior was proven affected by flow rate variation of chemical solution during Copper activation process.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal\",\"authors\":\"Poo Khai Yee, Wan Tatt Wai, Yong Foo Khong\",\"doi\":\"10.1109/IPFA.2014.6898185\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electroless Nickel deposition on Copper metallization required a thin Palladium layer (<; 5nm) as catalyst for Copper activation purpose. By using several physical failure analysis approaches, Palladium-Copper inter-diffusion behavior was proven affected by flow rate variation of chemical solution during Copper activation process.\",\"PeriodicalId\":409316,\"journal\":{\"name\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"56 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2014.6898185\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898185","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

在铜金属化上化学镀镍需要薄的钯层(<;5nm)作为铜活化催化剂。采用多种物理失效分析方法，验证了铜活化过程中钯-铜的互扩散行为受化学溶液流速变化的影响。

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Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal

Electroless Nickel deposition on Copper metallization required a thin Palladium layer (<; 5nm) as catalyst for Copper activation purpose. By using several physical failure analysis approaches, Palladium-Copper inter-diffusion behavior was proven affected by flow rate variation of chemical solution during Copper activation process.

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Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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