L. Negre, D. Roy, S. Boret, P. Scheer, N. Kauffmann, D. Gloria, G. Ghibaudo
{"title":"热载波对小信号等效电路的影响","authors":"L. Negre, D. Roy, S. Boret, P. Scheer, N. Kauffmann, D. Gloria, G. Ghibaudo","doi":"10.1109/IIRW.2010.5706489","DOIUrl":null,"url":null,"abstract":"RF reliability is becoming an increasing concern for actual technology platforms. In this context, small signal equivalent circuit degradation under hot carrier stress is investigated. It is shown that some lumped elements such as the conductance, the transconductance, the gate-to-drain capacitance, and series resistances are degraded. The application of corrections based on physical phenomenon explains the major part of the hot carrier impact on the small signal equivalent circuit. Furthermore, the overlap gate-to-drain capacitance degradation is emphasized.","PeriodicalId":332664,"journal":{"name":"2010 IEEE International Integrated Reliability Workshop Final Report","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Hot carrier impact on the small signal equivalent circuit\",\"authors\":\"L. Negre, D. Roy, S. Boret, P. Scheer, N. Kauffmann, D. Gloria, G. Ghibaudo\",\"doi\":\"10.1109/IIRW.2010.5706489\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"RF reliability is becoming an increasing concern for actual technology platforms. In this context, small signal equivalent circuit degradation under hot carrier stress is investigated. It is shown that some lumped elements such as the conductance, the transconductance, the gate-to-drain capacitance, and series resistances are degraded. The application of corrections based on physical phenomenon explains the major part of the hot carrier impact on the small signal equivalent circuit. Furthermore, the overlap gate-to-drain capacitance degradation is emphasized.\",\"PeriodicalId\":332664,\"journal\":{\"name\":\"2010 IEEE International Integrated Reliability Workshop Final Report\",\"volume\":\"53 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE International Integrated Reliability Workshop Final Report\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IIRW.2010.5706489\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Integrated Reliability Workshop Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIRW.2010.5706489","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Hot carrier impact on the small signal equivalent circuit
RF reliability is becoming an increasing concern for actual technology platforms. In this context, small signal equivalent circuit degradation under hot carrier stress is investigated. It is shown that some lumped elements such as the conductance, the transconductance, the gate-to-drain capacitance, and series resistances are degraded. The application of corrections based on physical phenomenon explains the major part of the hot carrier impact on the small signal equivalent circuit. Furthermore, the overlap gate-to-drain capacitance degradation is emphasized.