{"title":"用于低功耗电子器件的隧道场效应管的发展趋势和挑战","authors":"R. Rooyackers","doi":"10.1109/SBMicro.2019.8919391","DOIUrl":null,"url":null,"abstract":"The quest for low power electronics has driven extensive research on alternative device architectures. To maintain a sufficiently large ION/IOFF current ratio, devices with a subthreshold swing (SS) below the 60mV/decade limit as for MOSFETs are needed. Tunnel-FETs (TFET) promise a SS smaller than 60mV/dec and are therefore considered as interesting candidates to replace MOSFETs for low-power applications. However, the small band-to-band-tunneling efficiency due to the large indirect bandgap of silicon results in low on-currents of all-silicon TFETs. Therefore, new materials such as III-V compounds or germanium, featuring lower bandgaps and smaller effective mass to improve the tunneling efficiency, heterogeneous integration and different TFET device architectures are discussed. 2D semiconductors materials are also investigated for possible application in TFETs.","PeriodicalId":403446,"journal":{"name":"2019 34th Symposium on Microelectronics Technology and Devices (SBMicro)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Trends and challenges in Tunnel-FETs for low power electronics\",\"authors\":\"R. Rooyackers\",\"doi\":\"10.1109/SBMicro.2019.8919391\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The quest for low power electronics has driven extensive research on alternative device architectures. To maintain a sufficiently large ION/IOFF current ratio, devices with a subthreshold swing (SS) below the 60mV/decade limit as for MOSFETs are needed. Tunnel-FETs (TFET) promise a SS smaller than 60mV/dec and are therefore considered as interesting candidates to replace MOSFETs for low-power applications. However, the small band-to-band-tunneling efficiency due to the large indirect bandgap of silicon results in low on-currents of all-silicon TFETs. Therefore, new materials such as III-V compounds or germanium, featuring lower bandgaps and smaller effective mass to improve the tunneling efficiency, heterogeneous integration and different TFET device architectures are discussed. 2D semiconductors materials are also investigated for possible application in TFETs.\",\"PeriodicalId\":403446,\"journal\":{\"name\":\"2019 34th Symposium on Microelectronics Technology and Devices (SBMicro)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 34th Symposium on Microelectronics Technology and Devices (SBMicro)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SBMicro.2019.8919391\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 34th Symposium on Microelectronics Technology and Devices (SBMicro)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SBMicro.2019.8919391","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Trends and challenges in Tunnel-FETs for low power electronics
The quest for low power electronics has driven extensive research on alternative device architectures. To maintain a sufficiently large ION/IOFF current ratio, devices with a subthreshold swing (SS) below the 60mV/decade limit as for MOSFETs are needed. Tunnel-FETs (TFET) promise a SS smaller than 60mV/dec and are therefore considered as interesting candidates to replace MOSFETs for low-power applications. However, the small band-to-band-tunneling efficiency due to the large indirect bandgap of silicon results in low on-currents of all-silicon TFETs. Therefore, new materials such as III-V compounds or germanium, featuring lower bandgaps and smaller effective mass to improve the tunneling efficiency, heterogeneous integration and different TFET device architectures are discussed. 2D semiconductors materials are also investigated for possible application in TFETs.