{"title":"边界扫描测试的优点","authors":"S. L. Dingle, Luke D. Lacroix, Peter A. Twombly","doi":"10.1109/VTEST.1991.208136","DOIUrl":null,"url":null,"abstract":"Boundary scan has been used extensively by IBM in custom logic, standard cell, and gate array logic chips. Actual implementations of boundary-scan methods used in testing these chips are discussed. The benefits of this approach are reviewed, and an economic analysis of the cost savings attributable to boundary scan are presented.<<ETX>>","PeriodicalId":157539,"journal":{"name":"Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"The advantages of boundary-scan testing\",\"authors\":\"S. L. Dingle, Luke D. Lacroix, Peter A. Twombly\",\"doi\":\"10.1109/VTEST.1991.208136\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Boundary scan has been used extensively by IBM in custom logic, standard cell, and gate array logic chips. Actual implementations of boundary-scan methods used in testing these chips are discussed. The benefits of this approach are reviewed, and an economic analysis of the cost savings attributable to boundary scan are presented.<<ETX>>\",\"PeriodicalId\":157539,\"journal\":{\"name\":\"Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VTEST.1991.208136\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Papers 1991 VLSI Test Symposium 'Chip-to-System Test Concerns for the 90's","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTEST.1991.208136","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Boundary scan has been used extensively by IBM in custom logic, standard cell, and gate array logic chips. Actual implementations of boundary-scan methods used in testing these chips are discussed. The benefits of this approach are reviewed, and an economic analysis of the cost savings attributable to boundary scan are presented.<>
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
