栅极接地n-MOS对电离剂量的敏感性

T. Borel, A. Michez, S. Furic, E. Leduc, J. Boch, A. Touboul, B. Azais, S. Danzeca, L. Dusseau
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引用次数: 0

摘要

静电放电(ESD)是导致集成电路破坏的最关键事件之一。如今,大多数集成电路都设计有内置的ESD保护结构,必须是电中性的。本文研究了栅极接地nmosfet的TID退化。对来自Microchip的GGnMOS进行了退化假设和结构分析,强调了一些可能导致无法正确保护集成电路或导致这些结构泄漏电流增加的故障。
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Gate Grounded n-MOS Sensibility to Ionizing Dose
ESD (electrostatic discharges) is one of the most critical event leading most of the time to the destruction of integrated circuits. Nowadays, most of the integrated circuits are design with inbuilt ESD protections structures that have to be electrically neutral. TID degradation on Gate Grounded nMOSFETs is investigated in this paper. Degradation hypothesis and structure analysis performed on GGnMOS from Microchip have highlighted some possible failure that can lead to an inability to protect properly an integrated circuit, or to an increase of the leakage current of those structure.
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The RADECS 2018 Topical Day (Short Courses) TID Effects on Soft-breakdown and Self-heating Characteristics of 400V SOI NLDMOSFETs Issues and Special Aspects of Electronic Component Flight Test Results Usage for Radiation Hardness Confirmation ELDRS in p-MOS and p-MNOS Based RAD-FETs with Thick Gate Insulators: Experiment and Simulation RADECS 2018 Technical Program Chair Address
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