D. Carlton, K. Gleason, R. Hopkins, J. Jones, K. Noonan, E. Strid
{"title":"高速封装和互连寄生的精确测量","authors":"D. Carlton, K. Gleason, R. Hopkins, J. Jones, K. Noonan, E. Strid","doi":"10.1109/CICC.1988.20920","DOIUrl":null,"url":null,"abstract":"Various ideal structures such as small resistors, shorts, and transmission lines are used to verify the calibration of the measurement instrument at the probe tip. Typical measurements of package and interconnect performance are demonstrated, and sample measurements are made, including time domain reflectometry, propagation delay, isolation, and bypassing of power lines. Measurement results are shown.<<ETX>>","PeriodicalId":313270,"journal":{"name":"Proceedings of the IEEE 1988 Custom Integrated Circuits Conference","volume":"110 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Accurate measurement of high-speed package and interconnect parasitics\",\"authors\":\"D. Carlton, K. Gleason, R. Hopkins, J. Jones, K. Noonan, E. Strid\",\"doi\":\"10.1109/CICC.1988.20920\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Various ideal structures such as small resistors, shorts, and transmission lines are used to verify the calibration of the measurement instrument at the probe tip. Typical measurements of package and interconnect performance are demonstrated, and sample measurements are made, including time domain reflectometry, propagation delay, isolation, and bypassing of power lines. Measurement results are shown.<<ETX>>\",\"PeriodicalId\":313270,\"journal\":{\"name\":\"Proceedings of the IEEE 1988 Custom Integrated Circuits Conference\",\"volume\":\"110 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1988-05-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 1988 Custom Integrated Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.1988.20920\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 1988 Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1988.20920","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Accurate measurement of high-speed package and interconnect parasitics
Various ideal structures such as small resistors, shorts, and transmission lines are used to verify the calibration of the measurement instrument at the probe tip. Typical measurements of package and interconnect performance are demonstrated, and sample measurements are made, including time domain reflectometry, propagation delay, isolation, and bypassing of power lines. Measurement results are shown.<>
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