M. Calabretta, A. Sitta, Giuseppe Mauromicale, Francesco Rundo, G. Sequenzia, A. Messina
{"title":"SiC电源模块在汽车应用中的可靠性挑战","authors":"M. Calabretta, A. Sitta, Giuseppe Mauromicale, Francesco Rundo, G. Sequenzia, A. Messina","doi":"10.1109/ASDAM55965.2022.9966752","DOIUrl":null,"url":null,"abstract":"Silicon carbide (SiC)- based power modules in automotive applications are becoming more and more important in the framework of battery and hybrid vehicles. Consequently, the reliability concerns related to these products must be carefully assessed, considering the harsh environment of automotive applications. The aim of this work is to give some insights into the reliability assessments during the design stage of SiC modules devoted to traction applications, considering different aspects such as power cycle, thermal characterization, and solder joint reliability.","PeriodicalId":148302,"journal":{"name":"2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The reliability challenge of SiC Power Modules in Automotive Applications\",\"authors\":\"M. Calabretta, A. Sitta, Giuseppe Mauromicale, Francesco Rundo, G. Sequenzia, A. Messina\",\"doi\":\"10.1109/ASDAM55965.2022.9966752\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Silicon carbide (SiC)- based power modules in automotive applications are becoming more and more important in the framework of battery and hybrid vehicles. Consequently, the reliability concerns related to these products must be carefully assessed, considering the harsh environment of automotive applications. The aim of this work is to give some insights into the reliability assessments during the design stage of SiC modules devoted to traction applications, considering different aspects such as power cycle, thermal characterization, and solder joint reliability.\",\"PeriodicalId\":148302,\"journal\":{\"name\":\"2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)\",\"volume\":\"115 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-10-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASDAM55965.2022.9966752\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM55965.2022.9966752","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The reliability challenge of SiC Power Modules in Automotive Applications
Silicon carbide (SiC)- based power modules in automotive applications are becoming more and more important in the framework of battery and hybrid vehicles. Consequently, the reliability concerns related to these products must be carefully assessed, considering the harsh environment of automotive applications. The aim of this work is to give some insights into the reliability assessments during the design stage of SiC modules devoted to traction applications, considering different aspects such as power cycle, thermal characterization, and solder joint reliability.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
