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引用次数: 0
摘要
在一个新的嵌入式闪存平台上，电荷泵测试的故障率很高。直接将外部电流强制进入故障信号通路进行故障分析是不可能的，但我们在动态条件下进行了故障分析。然后我们通过发射范围捕获了金属短位置，这是罕见的。然后利用在线KLA SEM VC扫描确定了真正的失效机制——一种新型的天线效应，并结合工艺条件的变化对其进行了求解。我们将这种新型天线效应命名为“浮动天线效应”。
Finding a new type of in-line failure mechanism “Floating Antenna Effect” and its solution
On a new embedded flash platform we have got high failure rate on charge pump test. It is impossible to directly force external current into failure signal path to do FA but we did it under dynamic condition. Afterwards we have captured metal short locations by emission scope which is rarely seen. Then we used in-line KLA SEM VC scan to define the real failure mechanism - a new type of antenna effect, and finally solved it with combined process condition changes. We named the new type of antenna effect “Floating Antenna Effect”.
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