{"title":"光学无掩模光刻技术用于快速和低成本的晶圆设计","authors":"L. Hsu","doi":"10.1109/SMTW.2004.1393741","DOIUrl":null,"url":null,"abstract":"Increasing market pressures force design and manufacturing communities to come up with innovative and flexible design and manufacturing solutions to control cost and time to market. This work shows that optical maskless lithography (OML), requiring no mask at all, has lowest cost and shortest design-to-wafer times while keeping transparency to mask-based optical lithography and allowing for resolution enhancement via known low-k/sub 1/ imaging methods such as hard phase shifting and strong OPC.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"223 ","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optical maskless lithography for fast and low-cost design to wafer\",\"authors\":\"L. Hsu\",\"doi\":\"10.1109/SMTW.2004.1393741\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Increasing market pressures force design and manufacturing communities to come up with innovative and flexible design and manufacturing solutions to control cost and time to market. This work shows that optical maskless lithography (OML), requiring no mask at all, has lowest cost and shortest design-to-wafer times while keeping transparency to mask-based optical lithography and allowing for resolution enhancement via known low-k/sub 1/ imaging methods such as hard phase shifting and strong OPC.\",\"PeriodicalId\":369092,\"journal\":{\"name\":\"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)\",\"volume\":\"223 \",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-09-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMTW.2004.1393741\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMTW.2004.1393741","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Optical maskless lithography for fast and low-cost design to wafer
Increasing market pressures force design and manufacturing communities to come up with innovative and flexible design and manufacturing solutions to control cost and time to market. This work shows that optical maskless lithography (OML), requiring no mask at all, has lowest cost and shortest design-to-wafer times while keeping transparency to mask-based optical lithography and allowing for resolution enhancement via known low-k/sub 1/ imaging methods such as hard phase shifting and strong OPC.
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