针对深亚微米CMOS技术的CBCM(基于电荷的电容测量)改进

Randy Bach, Bob Davis, Rich Laubhan
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引用次数: 10

摘要

互连电容的准确测量和分析是纳米技术验证的关键组成部分。基于电荷的电容测量(CBCM)技术作为一种测量片上电容测试结构的可靠技术已被广泛采用。在本文中,我们提出了两种设计改进的CBCM。首先是通过使用总线电路架构来减少测试结构输入和输出信号所需的探测垫面积。第二个改进涉及在90和65nm工艺技术节点中减少栅极泄漏和电荷注入电流的影响。在90nm节点,我们证明了小型测试结构的精度提高了一个数量级
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Improvements to CBCM (charge-based capacitance measurement) for deep submicron CMOS technology
Accurate measurement and analysis of interconnect capacitance is a critical component of nanometer technology verification. The charged-based capacitance measurement (CBCM) technique has been widely adopted as a robust technique to measure on-chip capacitance test structures. In this paper we present two design improvements for CBCM. The first is an area reduction by using bused circuit architecture to reduce probe pad area required for the test structure input and output signals. The second improvement involves techniques to reduce the impact of gate leakage and charge injection currents in 90 and 65nm process technology nodes. At the 90nm node we demonstrate accuracy improvement of an order of magnitude for small test structures
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