{"title":"双核64b UltraSPARC微处理器实现的深亚微米设计挑战","authors":"T. Takayanagi, J. L. Shin, J. Su, A. Leon","doi":"10.1109/ICICDT.2004.1309933","DOIUrl":null,"url":null,"abstract":"A processor core, originally designed in a 0.5/spl mu/m Al process, is redesigned for a 0.13/spl mu/m Cu process to create a dual-core processor with 1MB integrated L2 cache, offering an efficient performance to power ratio for compute-dense server applications. Circuit design challenges, including negative bias temperature instability (NBTI), leakage, coupling noise and intra die process variation are discussed.","PeriodicalId":158994,"journal":{"name":"2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866)","volume":"19 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Deep-submicron design challenges for a dual-core 64b UltraSPARC microprocessor implementation\",\"authors\":\"T. Takayanagi, J. L. Shin, J. Su, A. Leon\",\"doi\":\"10.1109/ICICDT.2004.1309933\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A processor core, originally designed in a 0.5/spl mu/m Al process, is redesigned for a 0.13/spl mu/m Cu process to create a dual-core processor with 1MB integrated L2 cache, offering an efficient performance to power ratio for compute-dense server applications. Circuit design challenges, including negative bias temperature instability (NBTI), leakage, coupling noise and intra die process variation are discussed.\",\"PeriodicalId\":158994,\"journal\":{\"name\":\"2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866)\",\"volume\":\"19 5\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICICDT.2004.1309933\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICDT.2004.1309933","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Deep-submicron design challenges for a dual-core 64b UltraSPARC microprocessor implementation
A processor core, originally designed in a 0.5/spl mu/m Al process, is redesigned for a 0.13/spl mu/m Cu process to create a dual-core processor with 1MB integrated L2 cache, offering an efficient performance to power ratio for compute-dense server applications. Circuit design challenges, including negative bias temperature instability (NBTI), leakage, coupling noise and intra die process variation are discussed.