基于sonos的内存的总体操作注意事项

C. H. Lee, W. Tu, L. Chong, S. Gu, K.F. Chen, Y. J. Chen, J. Hsieh, I. Huang, N. Zous, T. Han, M. Chen, W. P. Lu, K. C. Chen, Tahui Wang, C.Y. Lu
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引用次数: 2

摘要

仿真了基于sonos结构的n+-poly和p+-poly栅极的擦除特性,以及TaN-gate+Al2O3组合的擦除特性。通过结合我们之前的研究,可以对SONOS和TANOS设备的程序、擦除和读取干扰等性能进行评估。不出所料,使用SONOS设备很难满足所有要求。在TANOS装置中,可以同时考虑这三个因素来指定最佳的底部氧化物厚度。此外,发现传统的外推方法不足以预测TANOS设备的寿命,并且往往低估了可容忍的读取偏差。
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Overall operation considerations for a SONOS-based memory
Erase characteristics of a SONOS-based structure are emulated not only for n+-poly and p+-poly gates but also for TaN-gate+Al2O3 combination. By incorporating our previous studies, performances including program, erase, and read disturb can be reviewed for both SONOS and TANOS devices. Unsurprisingly, it is hard to satisfy all requirements by using a SONOS device. In a TANOS device, an optimal bottom oxide thickness can be specified with the consideration of the three factors simultaneously. Moreover, it is found that conventional extrapolation methodology is inadequate to predict the lifetime of a TANOS device and tends to under-estimate the tolerable read bias.
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