SOI衬底栅氧化物质量的极性依赖性

H. Tseng, P. Tobin, S. Hong
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引用次数: 0

摘要

生长在SIMOX晶圆上的栅氧化物含有源自衬底的缺陷。缺陷诱捕可能导致SOI MOSFET器件的阈值电压不稳定问题以及栅极氧化物可靠性下降。因此,研究陷阱对SOI衬底栅氧化质量的影响是十分必要的。本文给出了不同电极附近不同的陷阱行为。我们发现在聚栅电极附近存在高密度的正电荷阱。除了粗糙的poly/Si0/sub 2/界面外,靠近poly/SiO/sub 2/界面的高密度正阱的存在会进一步降低SOI晶圆栅注入极性的栅氧化物可靠性。
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Polarity dependence of gate oxide quality with SOI substrates
Gate oxides grown on SIMOX wafers contain defects originating from the substrate. The defect-induced traps may cause a threshold voltage instability problem for SOI MOSFET devices as well as gate oxide reliability degradation. Therefore it is essential to study the effect of traps on gate oxide quality with SOI substrates. In this paper, different trap behavior near different electrodes is presented. We find that there are high density positive-charged traps near the poly gate electrode. In addition to the rough poly/Si0/sub 2/ interface, the existence of a high density of positive traps close to the poly/SiO/sub 2/ interface could further degrade the gate oxide reliability for gate injection polarity with SOI wafers.
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