动态力学分析仪(DMA)测定填充聚合物粘弹性的研究

S. Phansalkar, B. Han, E. Akbari, Paulius Vaitiekunas
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引用次数: 0

摘要

动态力学分析仪(DMA)在半导体工业中经常用于测量高度填充的热固性聚合物的粘弹性行为。高度填充的聚合物在粘弹性测量方面面临着独特的挑战,因为在操作和/或制造温度漂移过程中,模量会发生很大变化,因此DMA操作方式的设置和遗忘方式并不总是产生最准确的数据。本文首先讨论了与高填充聚合物相关的独特挑战,并提出了确定适当测试参数集的程序。
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On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)
Dynamic mechanical analyzers (DMA) are routinely practiced in the semiconductor industry to measure the viscoelastic behavior of highly filled thermosetting polymers. The highly filled polymers possess unique challenges in viscoelastic property measurements where set-and-forget style of DMA operation do not always produce the most accurate data due to a large change in modulus over operating and/or manufacturing temperature excursions. This paper discusses the unique challenges associated with the highly filled polymers first and proposes a procedure to determine a proper set of testing parameters.
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