利用高加速电压扫描电镜挖掘植入体缺陷

W. Hsu, Yu Hsiang Shu, Chenglong Pan
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引用次数: 1

摘要

由于种植体缺陷不容易被量化,而且不像桥式或开放式的物理缺陷那样容易被标准的FA仪器发现,因此很难被发现,我们可以得到电证据,但很难证明与种植体缺陷的关系。这里我们通过较高的电子束加速电压的SEM(扫描电子显微镜),通过不同的电荷在硅中的渗透深度来突出一个现象;我们可以通过观察SRAM异常区域的对比图像变化来验证植入物是否存在缺陷。
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Using Higher Accelerating Voltage of SEM to Dig Out Implant Defects
Implant defects are difficult to discover because they are not quantified easily and not like bridge or open physical defects to find them by standard FA’s instruments We can get electrical proof but hard to prove the relationship with implant defects. Here we highlight a phenomenon by higher electron beam accelerating voltage of SEM (Scanning Electron Microscope), through the different penetration depth of electrical charges in silicon; we can observe the variation of contrast images at abnormal area of SRAM to verify possible implant defects.
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