{"title":"利用高加速电压扫描电镜挖掘植入体缺陷","authors":"W. Hsu, Yu Hsiang Shu, Chenglong Pan","doi":"10.1109/IPFA47161.2019.8984876","DOIUrl":null,"url":null,"abstract":"Implant defects are difficult to discover because they are not quantified easily and not like bridge or open physical defects to find them by standard FA’s instruments We can get electrical proof but hard to prove the relationship with implant defects. Here we highlight a phenomenon by higher electron beam accelerating voltage of SEM (Scanning Electron Microscope), through the different penetration depth of electrical charges in silicon; we can observe the variation of contrast images at abnormal area of SRAM to verify possible implant defects.","PeriodicalId":169775,"journal":{"name":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Using Higher Accelerating Voltage of SEM to Dig Out Implant Defects\",\"authors\":\"W. Hsu, Yu Hsiang Shu, Chenglong Pan\",\"doi\":\"10.1109/IPFA47161.2019.8984876\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Implant defects are difficult to discover because they are not quantified easily and not like bridge or open physical defects to find them by standard FA’s instruments We can get electrical proof but hard to prove the relationship with implant defects. Here we highlight a phenomenon by higher electron beam accelerating voltage of SEM (Scanning Electron Microscope), through the different penetration depth of electrical charges in silicon; we can observe the variation of contrast images at abnormal area of SRAM to verify possible implant defects.\",\"PeriodicalId\":169775,\"journal\":{\"name\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"46 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA47161.2019.8984876\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA47161.2019.8984876","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Using Higher Accelerating Voltage of SEM to Dig Out Implant Defects
Implant defects are difficult to discover because they are not quantified easily and not like bridge or open physical defects to find them by standard FA’s instruments We can get electrical proof but hard to prove the relationship with implant defects. Here we highlight a phenomenon by higher electron beam accelerating voltage of SEM (Scanning Electron Microscope), through the different penetration depth of electrical charges in silicon; we can observe the variation of contrast images at abnormal area of SRAM to verify possible implant defects.