{"title":"2.3一种130- 180ghz 0.0035mm2 SPDT开关,损耗3.3dB,隔离度23.7dB,采用65nm块体CMOS","authors":"F. Meng, Kaixue Ma, K. Yeo","doi":"10.1109/ISSCC.2015.7062852","DOIUrl":null,"url":null,"abstract":"Single-pole double-throw (SPDT) switches are a key building block for enabling transceiver time-division duplexing (TDD) when operated as a T/R switch or for eliminating imager fluctuations when operated as a Dicke switch. To provide acceptable compromises of IMF, Pout and sensitivity in transceivers or imagers, the switches are required to feature an insertion loss of ~3dB and an isolation of ~20dB. Recently, mm-Wave/sub-mm-Wave transceiver and imager integrated circuits have gradually migrated to silicon platforms for low-cost consumer markets [1,2]. However, the associated SPDT switches operating beyond 110GHz are developed using advanced SOI or SiGe HBT technologies [3,4] and rarely implemented in CMOS due to the lossy substrate and poor transistor characteristics [2,5].","PeriodicalId":188403,"journal":{"name":"2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":"{\"title\":\"2.3 A 130-to-180GHz 0.0035mm2 SPDT switch with 3.3dB loss and 23.7dB isolation in 65nm bulk CMOS\",\"authors\":\"F. Meng, Kaixue Ma, K. Yeo\",\"doi\":\"10.1109/ISSCC.2015.7062852\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Single-pole double-throw (SPDT) switches are a key building block for enabling transceiver time-division duplexing (TDD) when operated as a T/R switch or for eliminating imager fluctuations when operated as a Dicke switch. To provide acceptable compromises of IMF, Pout and sensitivity in transceivers or imagers, the switches are required to feature an insertion loss of ~3dB and an isolation of ~20dB. Recently, mm-Wave/sub-mm-Wave transceiver and imager integrated circuits have gradually migrated to silicon platforms for low-cost consumer markets [1,2]. However, the associated SPDT switches operating beyond 110GHz are developed using advanced SOI or SiGe HBT technologies [3,4] and rarely implemented in CMOS due to the lossy substrate and poor transistor characteristics [2,5].\",\"PeriodicalId\":188403,\"journal\":{\"name\":\"2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-03-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"21\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.2015.7062852\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2015.7062852","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
2.3 A 130-to-180GHz 0.0035mm2 SPDT switch with 3.3dB loss and 23.7dB isolation in 65nm bulk CMOS
Single-pole double-throw (SPDT) switches are a key building block for enabling transceiver time-division duplexing (TDD) when operated as a T/R switch or for eliminating imager fluctuations when operated as a Dicke switch. To provide acceptable compromises of IMF, Pout and sensitivity in transceivers or imagers, the switches are required to feature an insertion loss of ~3dB and an isolation of ~20dB. Recently, mm-Wave/sub-mm-Wave transceiver and imager integrated circuits have gradually migrated to silicon platforms for low-cost consumer markets [1,2]. However, the associated SPDT switches operating beyond 110GHz are developed using advanced SOI or SiGe HBT technologies [3,4] and rarely implemented in CMOS due to the lossy substrate and poor transistor characteristics [2,5].