千兆级集成(GSI)的SOI MOSFET波动极限

Xinghai Tang, V. De, Lihui Wang, J. Meindl
{"title":"千兆级集成(GSI)的SOI MOSFET波动极限","authors":"Xinghai Tang, V. De, Lihui Wang, J. Meindl","doi":"10.1109/SOI.1999.819849","DOIUrl":null,"url":null,"abstract":"Intrinsic and extrinsic threshold voltage (V/sub ts/) fluctuations in fully depleted (FD) single gate (SG) and dual gate (DG) SOI MOSFETs as well as partially depleted (PD) SOI MOSFETs are investigated using novel 3D compact physical models. Threshold voltage maximum deviations due to intrinsic random dopant placement can escalate to more than /spl plusmn/100% for sub-100 nm technology generations. Much smaller (<1.5 mV) intrinsic threshold voltage fluctuations in undoped SOI MOSFETs are explored.","PeriodicalId":117832,"journal":{"name":"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1999-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"SOI MOSFET fluctuation limits on gigascale integration (GSI)\",\"authors\":\"Xinghai Tang, V. De, Lihui Wang, J. Meindl\",\"doi\":\"10.1109/SOI.1999.819849\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Intrinsic and extrinsic threshold voltage (V/sub ts/) fluctuations in fully depleted (FD) single gate (SG) and dual gate (DG) SOI MOSFETs as well as partially depleted (PD) SOI MOSFETs are investigated using novel 3D compact physical models. Threshold voltage maximum deviations due to intrinsic random dopant placement can escalate to more than /spl plusmn/100% for sub-100 nm technology generations. Much smaller (<1.5 mV) intrinsic threshold voltage fluctuations in undoped SOI MOSFETs are explored.\",\"PeriodicalId\":117832,\"journal\":{\"name\":\"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOI.1999.819849\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE International SOI Conference. Proceedings (Cat. No.99CH36345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.1999.819849","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

摘要

利用新颖的三维紧凑物理模型研究了完全耗尽(FD)单门(SG)和双门(DG) SOI mosfet以及部分耗尽(PD) SOI mosfet的内在和外在阈值电压(V/sub /)波动。对于sub-100 nm技术世代,由于内在随机掺杂物放置导致的阈值电压最大偏差可以升级到超过/spl plusmn/100%。在未掺杂的SOI mosfet中探索了更小(<1.5 mV)的固有阈值电压波动。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
SOI MOSFET fluctuation limits on gigascale integration (GSI)
Intrinsic and extrinsic threshold voltage (V/sub ts/) fluctuations in fully depleted (FD) single gate (SG) and dual gate (DG) SOI MOSFETs as well as partially depleted (PD) SOI MOSFETs are investigated using novel 3D compact physical models. Threshold voltage maximum deviations due to intrinsic random dopant placement can escalate to more than /spl plusmn/100% for sub-100 nm technology generations. Much smaller (<1.5 mV) intrinsic threshold voltage fluctuations in undoped SOI MOSFETs are explored.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A novel 0.7 V two-port 6T SRAM memory cell structure with single-bit-line simultaneous read-and-write access (SBLSRWA) capability using partially-depleted SOI CMOS dynamic-threshold technique Power amplifiers on thin-film-silicon-on-insulator (TFSOI) technology Single chip wireless systems using SOI Buried oxide fringing capacitance: a new physical model and its implication on SOI device scaling and architecture A bandgap circuit operating up to 300/spl deg/C using lateral bipolar transistors in thin-film CMOS-SOI technology
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1