具有隔离埋式多晶硅后门的完全耗尽双栅极薄膜SOI p-MOSFET

J. Denton, G. Neudeck
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引用次数: 9

摘要

采用隔离埋置多晶硅后门,制备了p沟道双门控薄膜绝缘体上硅(DG-TFSOI) MOSFET。这种结构允许每个器件的每个后门单独操作,而不是目前常见的后门(衬底)结构。使用单个埋地栅极动态移动每个顶部MOSFET的阈值电压的能力可能对低功耗电路具有重要意义,并提供了一种提高驱动电流以实现更快开关的方法。通过使用外延横向过生长(ELO),可以指定底部热埋氧化物的任何厚度。
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Fully depleted dual-gated thin-film SOI p-MOSFET with an isolated buried polysilicon backgate
A p-channel Dual-Gated Thin-Film Silicon-on-insulator (DG-TFSOI) MOSFET has been fabricated with an isolated buried polysilicon backgate and is in a SOI island. This structure allows individual operation of each backgate of each device, rather than the present common backgate (substrate) structure. The ability to use a individual buried gate to dynamically shift the threshold voltage of each individual top MOSFET may have significant implications for low power circuits and offers a way to boost drive currents for faster switching. By using Epitaxial Lateral Overgrowth (ELO) the bottom thermal buried oxide can be specified to any thickness.
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Analytical threshold voltage model for short channel n/sup +/-p/sup +/ double-gate SOI MOSFETs Front and back gate interface-trap generation due to hot carrier stress in fully depleted SOI/MOSFETs SOI material characterization using optical second harmonic generation Minimum parasitic resistance for ultra-thin SOI MOSFET with high-permittivity gate insulator performed by lateral contact structure Transient effects in floating body SOI NMOSFETs
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