Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

In aerospace, military, and automotive applications, various electronic parts may be subjected to sustained operation at high and low surrounding temperatures as well as high strain-rate loads. Previous research studies have shown that material properties of undoped SAC alloys evolve even at moderate temperatures after a prolonged period of storage. A variety of dopants has been introduced into SAC alloy formulations in order to reduce the aging effects. In this study, two doped SAC solder called QSAC10 and QSAC20, have been subjected to high strain rate testing after keeping them in storage at temperature of 50°C for 120 days. Samples with no aging to 120 days aged samples have been subjected to uniaxial tensile tests to measure the mechanical properties of SAC+Bi solders. The High and Low operating temperatures used in this experiment ranged from −65°C to 200°C. Then the experimental material data was used to compute the constants for the Anand Visco-Plasticity model. Using the Anand constitutive model, the material constitutive behavior has been implemented in a finite element framework to simulate the drop events.