{"title":"新颖的微纹理薄膜为3D设备的通用处理提供了希望","authors":"R. Varma, Jennifer Dossee Nunes","doi":"10.1109/asmc54647.2022.9792493","DOIUrl":null,"url":null,"abstract":"This paper will discuss the challenges associated with the constant evolution of IC device dimensions, and the need for carriers that can adapt quickly to the change in form factor but still maintain JEDEC standards for compatibility with existing equipment sets and pick & place tools. The paper will present a new technology inspired by gecko fibril microstructures with reversible adhesion that offers a unique approach to device handling.","PeriodicalId":436890,"journal":{"name":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"175 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Novel Micro-Textured Film Offers Promise in Universal Handling of 3D Devices\",\"authors\":\"R. Varma, Jennifer Dossee Nunes\",\"doi\":\"10.1109/asmc54647.2022.9792493\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper will discuss the challenges associated with the constant evolution of IC device dimensions, and the need for carriers that can adapt quickly to the change in form factor but still maintain JEDEC standards for compatibility with existing equipment sets and pick & place tools. The paper will present a new technology inspired by gecko fibril microstructures with reversible adhesion that offers a unique approach to device handling.\",\"PeriodicalId\":436890,\"journal\":{\"name\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"175 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/asmc54647.2022.9792493\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asmc54647.2022.9792493","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Novel Micro-Textured Film Offers Promise in Universal Handling of 3D Devices
This paper will discuss the challenges associated with the constant evolution of IC device dimensions, and the need for carriers that can adapt quickly to the change in form factor but still maintain JEDEC standards for compatibility with existing equipment sets and pick & place tools. The paper will present a new technology inspired by gecko fibril microstructures with reversible adhesion that offers a unique approach to device handling.
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