C. Hayzelden, C. Ygartua, T. Casavant, M. Slessor, A. Srivatsa, M. Guévremont, P. Stevens, M. Young, T. Lu, R. Zhang, C. Treadwell, D. Soltz, J. Lauber, M. Krumbuegel, R. Fiordalice, S. Lange, R. Marella, S. Ashkenaz, K. Monahan, T. K. Tran, J. Leu
{"title":"低/spl kappa/电介质的工艺模块控制[CVD]","authors":"C. Hayzelden, C. Ygartua, T. Casavant, M. Slessor, A. Srivatsa, M. Guévremont, P. Stevens, M. Young, T. Lu, R. Zhang, C. Treadwell, D. Soltz, J. Lauber, M. Krumbuegel, R. Fiordalice, S. Lange, R. Marella, S. Ashkenaz, K. Monahan, T. K. Tran, J. Leu","doi":"10.1109/ISSM.2000.993630","DOIUrl":null,"url":null,"abstract":"A process control system is composed of a variety of elements, from measurement technologies and techniques, through sampling strategies and analysis algorithms, to data-driven action plans. All components are required to ensure a stable process, however, effective control is founded upon a set of easily measured, yield-relevant parameters. In this work, we describe the use of a toolset and methodology to provide such parameters, and explore sampling and analysis components for the evaluation, development, and control of low-/spl kappa/ dielectric processes. In comparison to historically-employed interline dielectric (ILD) materials such as SiO/sub 2/, these low-/spl kappa/ materials and processes present significant integration, reliability, and stability concerns. A particularly sensitive parameter is the dielectric constant itself. Damage from high-power ultraviolet inspection techniques may also present challenges. As these relatively immature processes migrate into volume production, these same tools and parameters can be used to monitor the low-/spl kappa/ process module, improve baseline yield, and control excursions.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Process module control for low-/spl kappa/ dielectrics [CVD]\",\"authors\":\"C. Hayzelden, C. Ygartua, T. Casavant, M. Slessor, A. Srivatsa, M. Guévremont, P. Stevens, M. Young, T. Lu, R. Zhang, C. Treadwell, D. Soltz, J. Lauber, M. Krumbuegel, R. Fiordalice, S. Lange, R. Marella, S. Ashkenaz, K. Monahan, T. K. Tran, J. Leu\",\"doi\":\"10.1109/ISSM.2000.993630\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A process control system is composed of a variety of elements, from measurement technologies and techniques, through sampling strategies and analysis algorithms, to data-driven action plans. All components are required to ensure a stable process, however, effective control is founded upon a set of easily measured, yield-relevant parameters. In this work, we describe the use of a toolset and methodology to provide such parameters, and explore sampling and analysis components for the evaluation, development, and control of low-/spl kappa/ dielectric processes. In comparison to historically-employed interline dielectric (ILD) materials such as SiO/sub 2/, these low-/spl kappa/ materials and processes present significant integration, reliability, and stability concerns. A particularly sensitive parameter is the dielectric constant itself. Damage from high-power ultraviolet inspection techniques may also present challenges. As these relatively immature processes migrate into volume production, these same tools and parameters can be used to monitor the low-/spl kappa/ process module, improve baseline yield, and control excursions.\",\"PeriodicalId\":104122,\"journal\":{\"name\":\"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)\",\"volume\":\"64 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.2000.993630\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2000.993630","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Process module control for low-/spl kappa/ dielectrics [CVD]
A process control system is composed of a variety of elements, from measurement technologies and techniques, through sampling strategies and analysis algorithms, to data-driven action plans. All components are required to ensure a stable process, however, effective control is founded upon a set of easily measured, yield-relevant parameters. In this work, we describe the use of a toolset and methodology to provide such parameters, and explore sampling and analysis components for the evaluation, development, and control of low-/spl kappa/ dielectric processes. In comparison to historically-employed interline dielectric (ILD) materials such as SiO/sub 2/, these low-/spl kappa/ materials and processes present significant integration, reliability, and stability concerns. A particularly sensitive parameter is the dielectric constant itself. Damage from high-power ultraviolet inspection techniques may also present challenges. As these relatively immature processes migrate into volume production, these same tools and parameters can be used to monitor the low-/spl kappa/ process module, improve baseline yield, and control excursions.