{"title":"卡盘边界条件对宽带片上测量的影响","authors":"G. Phung, U. Arz","doi":"10.1109/SPI52361.2021.9505192","DOIUrl":null,"url":null,"abstract":"While a lot of investigations have been presented recently explaining the parasitic effects in on-wafer measurements caused by probes, neighborhood and environmental effects, this paper addresses the impact of chuck boundary conditions. Starting from a coplanar waveguide (CPW) measurement example, this paper demonstrates how the most relevant chuck parameters, i.e. thickness and relative permittivity, deteriorate the S-parameters of CPWs.","PeriodicalId":440368,"journal":{"name":"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Impact of Chuck Boundary Conditions on Wideband On-Wafer Measurements\",\"authors\":\"G. Phung, U. Arz\",\"doi\":\"10.1109/SPI52361.2021.9505192\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"While a lot of investigations have been presented recently explaining the parasitic effects in on-wafer measurements caused by probes, neighborhood and environmental effects, this paper addresses the impact of chuck boundary conditions. Starting from a coplanar waveguide (CPW) measurement example, this paper demonstrates how the most relevant chuck parameters, i.e. thickness and relative permittivity, deteriorate the S-parameters of CPWs.\",\"PeriodicalId\":440368,\"journal\":{\"name\":\"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI52361.2021.9505192\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI52361.2021.9505192","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Impact of Chuck Boundary Conditions on Wideband On-Wafer Measurements
While a lot of investigations have been presented recently explaining the parasitic effects in on-wafer measurements caused by probes, neighborhood and environmental effects, this paper addresses the impact of chuck boundary conditions. Starting from a coplanar waveguide (CPW) measurement example, this paper demonstrates how the most relevant chuck parameters, i.e. thickness and relative permittivity, deteriorate the S-parameters of CPWs.