用于高密度液冷数据中心的液空冷却

A. Heydari, Vahideh Radmard, Bahareh Eslami, Mohammad I. Tradat, Yaman M. Manaserh, Harold Miyamura, Uschas Chowdhury, Pardeep Shahi, Kevin Dave Hall, B. Sammakia, Jeremy Rodriguez
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摘要

为了支持深度学习和人工智能工作负载,对密集和高性能IT计算能力的需求不断增长,这使得数据中心必须寻找更强大的热管理策略。如今,世界各地的数据中心都在转向基于液体的冷却解决方案,以满足对接近100kW散热的大功率机架日益增长的冷却需求。部署直接到芯片的冷板液冷是主流的方法之一,它允许有针对性地冷却高功率处理器。本研究为一种混合式排冷器(IRC)提供了框架,该混合式排冷器带有液冷-空气(L2A)热交换器(HX)系统,该系统将冷冻冷却剂输送到安装在高散热电子设备上的液冷冷板上。这种方法对于数据中心没有主设施冷却剂的机架的高热密度冷却非常有用。本研究旨在研究一种独特的L2A IRC系统的热水力性能,该系统向现有风冷数据中心机架中的液冷服务器的冷却回路提供冷二次冷却剂(PG 25%)。热测试车辆(ttv)是用来复制实际的高密度服务器的。从冷板到数据中心级别,根据其冷却性能和相关性描述了每个级别组件的正确选择。对三种不同的冷却回路/机架设计进行了实验表征,并进行了详细的分析和数值模拟(FNM)来分析换热器的性能。采用稳态和瞬态两种形式建立了数据中心的FNM和CFD模型,研究了数据中心中L2A IRC的性能。
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Liquid to Air Cooling for High Heat Density Liquid Cooled Data Centers
Growing demand for dense and high-performing IT compute capacity to support deep learning and artificial intelligence workloads necessitates data centers to look for more robust thermal management strategies. Today, data centers across the world are turning to liquid-based cooling solutions to keep up with the increased cooling demand for high power racks approaching 100kW of heat dissipation. Deploying direct-to-chip cold plate liquid cooling is one of the mainstream approaches which allows targeted cooling of high-power processors. This study provides the framework for a hybrid in row cooler (IRC) with liquid-to-air (L2A) heat exchanger (HX) system delivering chilled coolant to liquid-cooling cold plates mounted to the high heat dissipation electronics. This approach is useful for high heat density cooling of racks where no primary facility coolant is available at the data center. The present study aims to investigate the thermo-hydraulic performance of a distinct L2A IRC system that supplies cold secondary coolant (PG 25%) into the cooling loops of liquid-cooled servers in racks within an existing air-cooled data center. Thermal test vehicles (TTVs) are built to replicate actual high heat density servers. From the cold plate to data center level the proper choice of each level component was described based on their cooling performance and relevance. Three different cooling loop/rack designs are characterized experimentally, and detailed analytical and numerical (FNM) simulations are developed to analyze the heat exchanger performance. The FNM and CFD model of a data center are done in two steady and transient forms to study the performance of the L2A IRC in a data center.
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