{"title":"平面包装中固化引起的应力和翘曲的分析估计","authors":"K. Jansen, J. de Vreugd, L. Ernst","doi":"10.1109/ESIME.2011.5765777","DOIUrl":null,"url":null,"abstract":"Warpage of flat packages is partly due to chemical shrinkage of the molding compound during cure and partly due to differences in thermal contraction in the subsequent cooling stage. The latter effect is relatively easy to incorporate in numerical simulations but the cure-induced shrinkage effect is not and is therefore often neglected in warpage simulations. Recent validation studies however showed that it is essential that both effects are taken into account.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Analytical estimate for cure-induced stresses and warpage in flat packages\",\"authors\":\"K. Jansen, J. de Vreugd, L. Ernst\",\"doi\":\"10.1109/ESIME.2011.5765777\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Warpage of flat packages is partly due to chemical shrinkage of the molding compound during cure and partly due to differences in thermal contraction in the subsequent cooling stage. The latter effect is relatively easy to incorporate in numerical simulations but the cure-induced shrinkage effect is not and is therefore often neglected in warpage simulations. Recent validation studies however showed that it is essential that both effects are taken into account.\",\"PeriodicalId\":115489,\"journal\":{\"name\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"volume\":\"85 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-04-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2011.5765777\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2011.5765777","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Analytical estimate for cure-induced stresses and warpage in flat packages
Warpage of flat packages is partly due to chemical shrinkage of the molding compound during cure and partly due to differences in thermal contraction in the subsequent cooling stage. The latter effect is relatively easy to incorporate in numerical simulations but the cure-induced shrinkage effect is not and is therefore often neglected in warpage simulations. Recent validation studies however showed that it is essential that both effects are taken into account.
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