非接触，在线热表征能力与时域热反射

2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Pub Date : 2022-05-02 DOI:10.1109/asmc54647.2022.9792510

R. Mair, G. A. Antonelli, M. Mehendale, P. Mukundhan, Beth May, Karen Terry, N. Brandt, Xiaoyue Phillip Huang, Tong Zhao

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引用次数: 0

摘要

热管理是集成器件设计和制造的一个关键方面。时域热反射(TDTR)是表征薄膜和多层堆叠中热输运的有力工具。在本文中，我们提出了在线非接触式，非破坏性皮秒超声测量的成功扩展，用于同时测量层厚度和热性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Non-Contact, In-Line Thermal Characterization Capability with Time Domain Thermoreflectance

Thermal management is a critical aspect of integrated device design and manufacture. Time Domain Thermoreflectance (TDTR) is a powerful tool for the characterization of thermal transport in thin films and multi-layer stacks. In this paper, we present successful extension of in-line non-contact, non-destructive picosecond ultrasonic metrology for simultaneous measurements of layer thickness and thermal properties.

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2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

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