{"title":"从FEOL堆积到集成电路芯片:AlCu衬垫上电微点蚀的完全相关","authors":"L. Sheng, Wei Pan, Zdenek Axman","doi":"10.1109/IIRW56459.2022.10032767","DOIUrl":null,"url":null,"abstract":"A full correlation of galvanic micro-pitting on AlCu pads has been for the first time revealed from FEOL buildups to IC chip. The presence of P-well was, in general, the primary factor of corrosion enhancement on specific pads. Therefore, the micro-pitting phenomenon should be more broadly examined well beyond the galvanic corrosion on individual pits. Furthermore, the electrons-limited electrochemical kinetics explain the pad-area dependence. This provides an excellent opportunity of design-for-reliability, where small pads can minimize the chance of micro-pitting occurrences.","PeriodicalId":446436,"journal":{"name":"2022 IEEE International Integrated Reliability Workshop (IIRW)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"From FEOL Buildups to IC Chip: A Full Correlation of Galvanic Micro-Pitting on AlCu Pads\",\"authors\":\"L. Sheng, Wei Pan, Zdenek Axman\",\"doi\":\"10.1109/IIRW56459.2022.10032767\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A full correlation of galvanic micro-pitting on AlCu pads has been for the first time revealed from FEOL buildups to IC chip. The presence of P-well was, in general, the primary factor of corrosion enhancement on specific pads. Therefore, the micro-pitting phenomenon should be more broadly examined well beyond the galvanic corrosion on individual pits. Furthermore, the electrons-limited electrochemical kinetics explain the pad-area dependence. This provides an excellent opportunity of design-for-reliability, where small pads can minimize the chance of micro-pitting occurrences.\",\"PeriodicalId\":446436,\"journal\":{\"name\":\"2022 IEEE International Integrated Reliability Workshop (IIRW)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Integrated Reliability Workshop (IIRW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IIRW56459.2022.10032767\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Integrated Reliability Workshop (IIRW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIRW56459.2022.10032767","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
From FEOL Buildups to IC Chip: A Full Correlation of Galvanic Micro-Pitting on AlCu Pads
A full correlation of galvanic micro-pitting on AlCu pads has been for the first time revealed from FEOL buildups to IC chip. The presence of P-well was, in general, the primary factor of corrosion enhancement on specific pads. Therefore, the micro-pitting phenomenon should be more broadly examined well beyond the galvanic corrosion on individual pits. Furthermore, the electrons-limited electrochemical kinetics explain the pad-area dependence. This provides an excellent opportunity of design-for-reliability, where small pads can minimize the chance of micro-pitting occurrences.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
