合理的电阻膏与低TCR使用康士坦

Pascal Sobek, K. Reinhardt, S. Körner
{"title":"合理的电阻膏与低TCR使用康士坦","authors":"Pascal Sobek, K. Reinhardt, S. Körner","doi":"10.23919/empc53418.2021.9584997","DOIUrl":null,"url":null,"abstract":"Fraunhofer IKTS presents first results of thick-film Constantan pastes as an attractive alternative for resistor and heater applications. We report on influencing the sheet resistance of screen-printed Constantan pastes by variation of paste composition and constitution, as well as architectural conditions. It is shown, how to adjust sheet resistance of Constantan pastes over a range of multiple orders of magnitude. Investigations of the structure of the fired pastes reveal a change of composition of the annealed pastes. Experiments using a new adapted glass promise suppression of those changes.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Reasonable resistor pastes with low TCR using Constantan\",\"authors\":\"Pascal Sobek, K. Reinhardt, S. Körner\",\"doi\":\"10.23919/empc53418.2021.9584997\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Fraunhofer IKTS presents first results of thick-film Constantan pastes as an attractive alternative for resistor and heater applications. We report on influencing the sheet resistance of screen-printed Constantan pastes by variation of paste composition and constitution, as well as architectural conditions. It is shown, how to adjust sheet resistance of Constantan pastes over a range of multiple orders of magnitude. Investigations of the structure of the fired pastes reveal a change of composition of the annealed pastes. Experiments using a new adapted glass promise suppression of those changes.\",\"PeriodicalId\":348887,\"journal\":{\"name\":\"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)\",\"volume\":\"61 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-09-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/empc53418.2021.9584997\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/empc53418.2021.9584997","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

弗劳恩霍夫IKTS提出了厚膜康斯坦坦浆料作为电阻和加热器应用的有吸引力的替代品的第一个结果。我们报道了影响丝网印刷康士坦浆料抗片性的浆料组成和组成的变化,以及建筑条件。它显示了,如何调整康斯坦坦糊片电阻在多个数量级的范围内。对烧成糊状物结构的研究揭示了退火糊状物组成的变化。使用一种新的适应性玻璃的实验有望抑制这些变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Reasonable resistor pastes with low TCR using Constantan
Fraunhofer IKTS presents first results of thick-film Constantan pastes as an attractive alternative for resistor and heater applications. We report on influencing the sheet resistance of screen-printed Constantan pastes by variation of paste composition and constitution, as well as architectural conditions. It is shown, how to adjust sheet resistance of Constantan pastes over a range of multiple orders of magnitude. Investigations of the structure of the fired pastes reveal a change of composition of the annealed pastes. Experiments using a new adapted glass promise suppression of those changes.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Throughput Optimization of a Sintering Die Attach Process Thermal Properties of Laser-induced Graphene Films Photothermally Scribed on Bare Polyimide Substrates Packaging Solution for RF SiP with on-top Integrated Antenna Development of a Quick Test for Conformal Coatings Properties of nano-composite SACX0307-(ZnO, TiO2) solders
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1