用于半导体工业失控检测的OC-SVM引擎优化

Rabhi Ilham, Roussy Agnes, Pasqualini Francois
{"title":"用于半导体工业失控检测的OC-SVM引擎优化","authors":"Rabhi Ilham, Roussy Agnes, Pasqualini Francois","doi":"10.1109/asmc54647.2022.9792530","DOIUrl":null,"url":null,"abstract":"Considering the importance of detecting anomalies as soon as they occur in the semiconductor industry, we propose in this paper to study the effectiveness of a robust machine learning classification technique, which is the One-Class Support Vector Machine (OC-SVM), used for out-of-control detection in production line. An optimization of the OC-SVM is proposed to improve its performance with a brief overview of the different methods used in this purpose. Numerical results are then presented based on industrial data provided by STMicroelectronics Crolles.","PeriodicalId":436890,"journal":{"name":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optimization of OC-SVM engine used for out-of-control detection in semiconductor industry\",\"authors\":\"Rabhi Ilham, Roussy Agnes, Pasqualini Francois\",\"doi\":\"10.1109/asmc54647.2022.9792530\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Considering the importance of detecting anomalies as soon as they occur in the semiconductor industry, we propose in this paper to study the effectiveness of a robust machine learning classification technique, which is the One-Class Support Vector Machine (OC-SVM), used for out-of-control detection in production line. An optimization of the OC-SVM is proposed to improve its performance with a brief overview of the different methods used in this purpose. Numerical results are then presented based on industrial data provided by STMicroelectronics Crolles.\",\"PeriodicalId\":436890,\"journal\":{\"name\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/asmc54647.2022.9792530\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/asmc54647.2022.9792530","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

考虑到在半导体行业中发现异常的重要性,我们提出研究一种鲁棒机器学习分类技术的有效性,即一类支持向量机(OC-SVM),用于生产线的失控检测。提出了一种优化OC-SVM以提高其性能,并简要概述了用于此目的的不同方法。然后根据意法半导体公司提供的工业数据给出了数值结果。
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Optimization of OC-SVM engine used for out-of-control detection in semiconductor industry
Considering the importance of detecting anomalies as soon as they occur in the semiconductor industry, we propose in this paper to study the effectiveness of a robust machine learning classification technique, which is the One-Class Support Vector Machine (OC-SVM), used for out-of-control detection in production line. An optimization of the OC-SVM is proposed to improve its performance with a brief overview of the different methods used in this purpose. Numerical results are then presented based on industrial data provided by STMicroelectronics Crolles.
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