Shen Yiqiang, Chen Yixin, Lee Hwang Sheng, Chow Shue Yin, X. Z. Xiang, H. Younan, Li Xiaomin
{"title":"锡焊锡球氧化态的XPS和TEM研究","authors":"Shen Yiqiang, Chen Yixin, Lee Hwang Sheng, Chow Shue Yin, X. Z. Xiang, H. Younan, Li Xiaomin","doi":"10.1109/IPFA.2014.6898151","DOIUrl":null,"url":null,"abstract":"A Sn oxide layer on the surface of Sn solder balls plays an important role in the semiconductor packaging industry. This paper shows a comprehensive analysis of the Sn oxide layer by XPS depth profiles. The distribution of Sn with different oxidation states can be derived from curves fitting Sn3d5/2 peaks. Moreover, the oxide layer thicknesses obtained from XPS demonstrate a linear correlation with the values from TEM measurements.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"XPS and TEM studies of oxidation states on Sn solder ball\",\"authors\":\"Shen Yiqiang, Chen Yixin, Lee Hwang Sheng, Chow Shue Yin, X. Z. Xiang, H. Younan, Li Xiaomin\",\"doi\":\"10.1109/IPFA.2014.6898151\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A Sn oxide layer on the surface of Sn solder balls plays an important role in the semiconductor packaging industry. This paper shows a comprehensive analysis of the Sn oxide layer by XPS depth profiles. The distribution of Sn with different oxidation states can be derived from curves fitting Sn3d5/2 peaks. Moreover, the oxide layer thicknesses obtained from XPS demonstrate a linear correlation with the values from TEM measurements.\",\"PeriodicalId\":409316,\"journal\":{\"name\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2014.6898151\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898151","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
XPS and TEM studies of oxidation states on Sn solder ball
A Sn oxide layer on the surface of Sn solder balls plays an important role in the semiconductor packaging industry. This paper shows a comprehensive analysis of the Sn oxide layer by XPS depth profiles. The distribution of Sn with different oxidation states can be derived from curves fitting Sn3d5/2 peaks. Moreover, the oxide layer thicknesses obtained from XPS demonstrate a linear correlation with the values from TEM measurements.
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