300mm DRAM晶圆厂致命缺陷管理的有效方法

2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846) Pub Date : 2004-09-09 DOI:10.1109/SMTW.2004.1393721

L. Lin, J.Y. Chen, E. Chou, Y. Miura, S. Chang, J. Chiu

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引用次数: 0

摘要

一种新的缺陷分类方法RDC(实时缺陷分类)，通过将缺陷从所有检测到的缺陷中分离出来，对300mm DRAM生产线的缺陷进行检测后的致命缺陷进行管理。实践证明，该方法可以有效地监控致命缺陷的趋势，帮助工艺工程师和集成工程师通过RDC对致命缺陷的监视来提高产品良率。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effective methodology for killer defect management in 300 mm DRAM fab

One new defect classification method called RDC (real-time defect classification) is used to manage killer defects in 300 mm DRAM production line after defect inspection by separating killer defects from all detected defects. Such method is proven to effectively monitor the trend of killer defects which help process engineer and integration engineer to enhance production yield by the watch of killer defect from RDC.

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2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)

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