{"title":"毫米波频率下bond线特性对性能的影响","authors":"Serhat Y. Çekiç, Arif Ergen, Alperen Tunç","doi":"10.23919/empc53418.2021.9584949","DOIUrl":null,"url":null,"abstract":"In this paper, the high-frequency behavior of various bondwire types is explained in terms of diameter and interconnect number up to millimeter-wave frequencies. The inductive effect of several bondwires which are used in high-frequency circuits, was calculated by considering height, angle, and length. After these calculations, 3D models and electromagnetic simulations of these interconnections were realized with a computer-aided design tool. Then, bondwires which have different characteristics, are implemented on alumina transmission lines. Furthermore, S-parameters were measured with a 2-port network analyzer using a probe station. Measured insertion loss and reflection values were compared with 3D electromagnetic simulation results, in order to obtain conceivable interconnection.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Performance Effects of Bondwire Characteristics Up to mmWave Frequencies\",\"authors\":\"Serhat Y. Çekiç, Arif Ergen, Alperen Tunç\",\"doi\":\"10.23919/empc53418.2021.9584949\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the high-frequency behavior of various bondwire types is explained in terms of diameter and interconnect number up to millimeter-wave frequencies. The inductive effect of several bondwires which are used in high-frequency circuits, was calculated by considering height, angle, and length. After these calculations, 3D models and electromagnetic simulations of these interconnections were realized with a computer-aided design tool. Then, bondwires which have different characteristics, are implemented on alumina transmission lines. Furthermore, S-parameters were measured with a 2-port network analyzer using a probe station. Measured insertion loss and reflection values were compared with 3D electromagnetic simulation results, in order to obtain conceivable interconnection.\",\"PeriodicalId\":348887,\"journal\":{\"name\":\"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-09-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/empc53418.2021.9584949\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/empc53418.2021.9584949","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Performance Effects of Bondwire Characteristics Up to mmWave Frequencies
In this paper, the high-frequency behavior of various bondwire types is explained in terms of diameter and interconnect number up to millimeter-wave frequencies. The inductive effect of several bondwires which are used in high-frequency circuits, was calculated by considering height, angle, and length. After these calculations, 3D models and electromagnetic simulations of these interconnections were realized with a computer-aided design tool. Then, bondwires which have different characteristics, are implemented on alumina transmission lines. Furthermore, S-parameters were measured with a 2-port network analyzer using a probe station. Measured insertion loss and reflection values were compared with 3D electromagnetic simulation results, in order to obtain conceivable interconnection.