毫米波频率下bond线特性对性能的影响

Serhat Y. Çekiç, Arif Ergen, Alperen Tunç
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引用次数: 0

摘要

在本文中,从直径和互连数的角度解释了各种键合线类型在毫米波频率下的高频行为。考虑了高频电路中几种结合线的高度、角度和长度,计算了其感应效应。通过这些计算,利用计算机辅助设计工具实现了这些互连的三维模型和电磁仿真。然后,在氧化铝传输线上实现具有不同特性的结合线。此外,s参数的测量与2端口网络分析仪使用探针站。将测量的插入损耗和反射值与三维电磁仿真结果进行比较,以获得可想象的互连。
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The Performance Effects of Bondwire Characteristics Up to mmWave Frequencies
In this paper, the high-frequency behavior of various bondwire types is explained in terms of diameter and interconnect number up to millimeter-wave frequencies. The inductive effect of several bondwires which are used in high-frequency circuits, was calculated by considering height, angle, and length. After these calculations, 3D models and electromagnetic simulations of these interconnections were realized with a computer-aided design tool. Then, bondwires which have different characteristics, are implemented on alumina transmission lines. Furthermore, S-parameters were measured with a 2-port network analyzer using a probe station. Measured insertion loss and reflection values were compared with 3D electromagnetic simulation results, in order to obtain conceivable interconnection.
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