{"title":"场辅助扩散法制备集成定向耦合器的研究","authors":"Daniel Uebach, Thomas Kühler, E. Griese","doi":"10.1109/SPI52361.2021.9505219","DOIUrl":null,"url":null,"abstract":"An integrated directional couplers manufactured in thin glass sheets by a field-assisted diffusion process is analyzed. The Coupler is designed for a simultaneous bidirectional chip-to-chip intercommunication in Electro-Optical Printed Circuit Boards (EOPCBs). A numerical investigation to optimize the designed coupler efficiency is presented using a geometrical optics algorithm. The results are verified by measurements to achieve an optimal coupler structure.","PeriodicalId":440368,"journal":{"name":"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Investigation of an Integrated Directional Coupler Manufactured by a Field-Assisted Diffusion Process\",\"authors\":\"Daniel Uebach, Thomas Kühler, E. Griese\",\"doi\":\"10.1109/SPI52361.2021.9505219\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An integrated directional couplers manufactured in thin glass sheets by a field-assisted diffusion process is analyzed. The Coupler is designed for a simultaneous bidirectional chip-to-chip intercommunication in Electro-Optical Printed Circuit Boards (EOPCBs). A numerical investigation to optimize the designed coupler efficiency is presented using a geometrical optics algorithm. The results are verified by measurements to achieve an optimal coupler structure.\",\"PeriodicalId\":440368,\"journal\":{\"name\":\"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI52361.2021.9505219\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI52361.2021.9505219","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Investigation of an Integrated Directional Coupler Manufactured by a Field-Assisted Diffusion Process
An integrated directional couplers manufactured in thin glass sheets by a field-assisted diffusion process is analyzed. The Coupler is designed for a simultaneous bidirectional chip-to-chip intercommunication in Electro-Optical Printed Circuit Boards (EOPCBs). A numerical investigation to optimize the designed coupler efficiency is presented using a geometrical optics algorithm. The results are verified by measurements to achieve an optimal coupler structure.
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