体型和SOI型mosfet中等离子体诱导充电损伤的比较

M. Sherony, A. Chen, K. Mistry, D. Antoniadis, B. Doyle
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引用次数: 5

摘要

采用零时间介电击穿测量方法,研究了体型和SOI n- mosfet的等离子体诱导充电损伤。结果表明,与体硅器件相比,SOI器件的TZDB分布对天线比的依赖性较小,且不易受到天线充电损伤的影响。SOI的显著不同的行为意味着对体积mosfet和SOI mosfet的天线设计规则要求将不相同。最后,我们注意到SOI器件中的天线损伤效应可能取决于相对于等离子体非均匀性长度尺度的硅岛的大小。
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Comparison of plasma-induced charging damage in bulk and SOI MOSFETs
Plasma-induced charging damage was examined on both bulk and SOI n-MOSFETs using time-zero dielectric breakdown measurements. It was found that the TZDB distributions for the SOI devices were less dependent on antenna ratio and less susceptible to antenna charging damage than bulk silicon devices. The dramatically different behavior for SOI implies that the antenna design rule requirements for bulk and SOI MOSFETs will not be the same. Finally, it is noted that antenna damage effects in SOI devices may depend on the size of the silicon island relative to the length scale of the plasma non-uniformity.
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Analytical threshold voltage model for short channel n/sup +/-p/sup +/ double-gate SOI MOSFETs Front and back gate interface-trap generation due to hot carrier stress in fully depleted SOI/MOSFETs SOI material characterization using optical second harmonic generation Minimum parasitic resistance for ultra-thin SOI MOSFET with high-permittivity gate insulator performed by lateral contact structure Transient effects in floating body SOI NMOSFETs
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