回顾STT-MRAM电路设计策略,以及40nm 1T-1MTJ 128Mb STT-MRAM设计实践

H. Koike, T. Tanigawa, Toshinari Watanabe, T. Nasuno, Y. Noguchi, M. Yasuhira, T. Yoshiduka, Yitao Ma, H. Honjo, K. Nishioka, S. Miura, H. Inoue, S. Ikeda, T. Endoh
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引用次数: 3

摘要

STT-MRAM现在是未来低功耗电子产品的重要组件。最近,一些主要LSI厂商相继披露了STT-MRAM的发展[1]-[9],其中一些厂商宣布已经开始了STT-MRAM的风险量产。本文借此机会回顾了STT-MRAM电路设计策略,包括存储单元设计,感测放大器(S/A)和参考发生器(Refgen)以及阵列架构。此外,作为STT-MRAM设计的一个例子,将介绍使用40纳米标准CMOS和3X-nm MTJ技术的128Mb STT-MRAM芯片[10]。
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Review of STT-MRAM circuit design strategies, and a 40-nm 1T-1MTJ 128Mb STT-MRAM design practice
STT-MRAM is now an essential component for future low power consumption electronics. Recently, a number of STT-MRAM developments have been successively disclosed by major LSI vendors [1] –[9], and some of them announced that risk mass-production of STT-MRAM had started. This invited paper reviews, in this opportunity, STT-MRAM circuit design strategies, which cover memory cell design, sense amplifier (S/A) and reference generator (Refgen), and array architecture. Furthermore, as one example of STT-MRAM design, a 128Mb STT-MRAM chip using 40-nm standard CMOS and 3X-nm MTJ technology will be presented [10].
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