CMOS射频噪声,缩放,和紧凑的建模为RFIC设计

A. Antonopoulos, M. Bucher, K. Papathanasiou, N. Makris, R. K. Sharma, P. Sakalas, M. Schroter
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引用次数: 13

摘要

本文分析了90纳米CMOS工艺的高频噪声和线性性能。测量进行了广泛范围的标称栅极长度和高频偏压点。建模基于Cadence公司Spectre射频电路模拟器中的EKV3紧凑型模型。考虑到速度饱和(VS)和信道长度调制(CLM)等短信道效应(sce),该模型显示了正确的噪声和线性可扩展性。结果与通道反转水平的共同测量,称为反转系数相比较。当从240 nm缩放到100 nm时,最佳性能显示从较高到较低的中等反转水平逐渐转变。从180 nm到22 nm技术节点的共源(CS) LNA的跨导频率积(TFP)研究中也观察到同样的趋势。
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CMOS RF noise, scaling, and compact modeling for RFIC design
This work presents an analysis of high frequency noise and linearity performance of a 90 nm CMOS process. Measurements are performed for a wide range of nominal gate lengths and bias points at high frequency. Modeling is based on the EKV3 compact model in Spectre RF circuit simulator from Cadence. The model shows correct scalability for noise and linearity accounting for short channel effects (SCEs), such as velocity saturation (VS) and channel length modulation (CLM). Results are presented versus a common measure of channel inversion level, named inversion coefficient. Optimum performance is shown to gradually shift from higher to lower levels of moderate inversion, when scaling from 240 nm to 100 nm. The same trend is observed from investigating the transconductance frequency product (TFP) of a common-source (CS) LNA for technology nodes ranging from 180 nm to 22 nm.
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