具有低输出电导的3通道InP-HEMT

H. Maher, J. Decobert, A. Falcou, G. Post, A. Scavennec
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引用次数: 1

摘要

研究了三通道(InGaAs-AlGaInAs-InP) HEMT结构在高击穿电压下的应用。该结构同时利用了InGaAs通道在低场下的高电子迁移率和InP通道的低冲击电离系数。该晶体管实际表现出良好的动态性能和高击穿电压:对于0.8 /spl mu/m栅极长度,我们得到:gm=240 mS/mm, Idss=225 mA/mm, Vbrd=6.5 V, f/sub t/=35 GHz, f/sub max/> = 90 GHz。这种HEMT结构的一个特殊特征是其低输出电导(在低频和高频下均为gm/gd=40),这主要归因于势垒层未掺杂,而/spl δ /掺杂位于通道的中间。对于所研究的栅极长度为0.8 /spl mu/m的器件,输出电导远低于具有相似几何结构的单通道或双通道hemt。当栅极长度较短时(在Lg=0.2 /spl mu/m时),该特性保持不变。本文对该输出电导进行了分析,说明了冲击电离和残留陷阱的重要性。
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A 3-channel InP-HEMT with low output conductance
A triple channel (InGaAs-AlGaInAs-InP) HEMT structure has been investigated for high breakdown voltage applications. This structure takes advantage simultaneously of both the high electron mobility at low field in the InGaAs channel and the low impact ionization coefficient in the InP channel. The transistor actually shows good dynamic performances and high breakdown voltage: for a 0.8 /spl mu/m gate length we obtained: gm=240 mS/mm, Idss=225 mA/mm, Vbrd=6.5 V, f/sub t/=35 GHz, f/sub max/>90 GHz. A specific feature of this HEMT structure is its low output conductance (gm/gd=40 at both low and high frequency) attributed in particular to the fact that the barrier layer is undoped, with the /spl delta/-doping sitting in the middle of the channel. For the 0.8 /spl mu/m gate length devices investigated, the output conductance is much lower than for single or dual channel HEMTs fabricated with similar geometry. This feature is maintained for shorter gate length (at Lg=0.2 /spl mu/m). In this paper an analysis of this output conductance is presented, illustrating the importance of impact ionization and residual traps.
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