磁显微术与x射线计算机断层扫描相结合对三维电流映射的改进

Nicolas Courjault, Fulvia Infante, V. Bley, T. Lebey, P. Perdu
{"title":"磁显微术与x射线计算机断层扫描相结合对三维电流映射的改进","authors":"Nicolas Courjault, Fulvia Infante, V. Bley, T. Lebey, P. Perdu","doi":"10.1109/IPFA.2014.6898141","DOIUrl":null,"url":null,"abstract":"Magnetic Microscopy has demonstrated all its functionality for 2D component thanks to its ability to image current density distribution from magnetic field. At the “More than Moore” age, we need to improve our capabilities to detect and localize failure in 3D components. Unfortunately, it is not possible to directly image 3D current density from a magnetic field scan. 3D conductive path information, that could come from design, and failure assumptions are also needed. In this paper, a new approach based on X-Ray Computed Tomography that bypasses the need of design information and failure site assumptions is presented and its results are discussed.","PeriodicalId":409316,"journal":{"name":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Improvement of 3D current mapping by coupling magnetic microscopy and X-Ray computed tomography\",\"authors\":\"Nicolas Courjault, Fulvia Infante, V. Bley, T. Lebey, P. Perdu\",\"doi\":\"10.1109/IPFA.2014.6898141\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Magnetic Microscopy has demonstrated all its functionality for 2D component thanks to its ability to image current density distribution from magnetic field. At the “More than Moore” age, we need to improve our capabilities to detect and localize failure in 3D components. Unfortunately, it is not possible to directly image 3D current density from a magnetic field scan. 3D conductive path information, that could come from design, and failure assumptions are also needed. In this paper, a new approach based on X-Ray Computed Tomography that bypasses the need of design information and failure site assumptions is presented and its results are discussed.\",\"PeriodicalId\":409316,\"journal\":{\"name\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-09-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2014.6898141\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2014.6898141","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

由于磁性显微镜能够从磁场中成像电流密度分布,因此它已经证明了其在2D组件中的所有功能。在“超越摩尔”时代,我们需要提高检测和定位3D组件故障的能力。不幸的是,不可能从磁场扫描中直接成像三维电流密度。3D导电路径信息可能来自设计,也需要故障假设。本文提出了一种基于x射线计算机断层扫描的新方法,该方法不需要设计信息和故障点假设,并对其结果进行了讨论。
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Improvement of 3D current mapping by coupling magnetic microscopy and X-Ray computed tomography
Magnetic Microscopy has demonstrated all its functionality for 2D component thanks to its ability to image current density distribution from magnetic field. At the “More than Moore” age, we need to improve our capabilities to detect and localize failure in 3D components. Unfortunately, it is not possible to directly image 3D current density from a magnetic field scan. 3D conductive path information, that could come from design, and failure assumptions are also needed. In this paper, a new approach based on X-Ray Computed Tomography that bypasses the need of design information and failure site assumptions is presented and its results are discussed.
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