S. Wiese, M. Mueller, I. Panchenko, R. Metasch, K. Wolter
{"title":"超小型焊点的蠕变行为和显微组织","authors":"S. Wiese, M. Mueller, I. Panchenko, R. Metasch, K. Wolter","doi":"10.1109/ESIME.2011.5765827","DOIUrl":null,"url":null,"abstract":"The creep behavior of Sn-based solders undergoes a significant scaling effect. Therefore this paper compares creep data that was gained on bulky samples and on small solder joints. Optical microscopy techniques and SEM-microprobe analysis were used to examine the microstructural properties of the bulk specimens and real solder joints were after metallographic sectioning. The results of these microstructural analysis were related to the investigated mechanical properties of the solders.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"28 6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The creep behaviour and microstructure of ultra small solder joints\",\"authors\":\"S. Wiese, M. Mueller, I. Panchenko, R. Metasch, K. Wolter\",\"doi\":\"10.1109/ESIME.2011.5765827\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The creep behavior of Sn-based solders undergoes a significant scaling effect. Therefore this paper compares creep data that was gained on bulky samples and on small solder joints. Optical microscopy techniques and SEM-microprobe analysis were used to examine the microstructural properties of the bulk specimens and real solder joints were after metallographic sectioning. The results of these microstructural analysis were related to the investigated mechanical properties of the solders.\",\"PeriodicalId\":115489,\"journal\":{\"name\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"volume\":\"28 6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-04-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2011.5765827\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2011.5765827","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The creep behaviour and microstructure of ultra small solder joints
The creep behavior of Sn-based solders undergoes a significant scaling effect. Therefore this paper compares creep data that was gained on bulky samples and on small solder joints. Optical microscopy techniques and SEM-microprobe analysis were used to examine the microstructural properties of the bulk specimens and real solder joints were after metallographic sectioning. The results of these microstructural analysis were related to the investigated mechanical properties of the solders.
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