谷裂对应变硅薄膜自旋弛豫时间的影响

J. Ghosh, V. Sverdlov, S. Selberherr
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引用次数: 2

摘要

电子自旋特性对未来的自旋驱动器件有很大的应用前景。与电荷相反,自旋不是一个守恒量,具有足够长的自旋寿命对应用至关重要。硅是微电子学的主要材料,也是自旋电子学应用的理想材料。研究了超薄硅薄膜在应变作用下子带结构的特点和自旋传播的细节。施加单轴应力可以提高(001)硅薄膜中剩余两个谷之间的简并度。通过Γ-point的[001]等效谷耦合,在受限的松弛电子结构中导致子带分裂,适当地包括在内。评估了其对等效子带分裂剪切应变的影响,从而预测了自旋寿命对谷分裂的依赖关系。在所有可能的条件下,观察到自旋寿命提高了几个数量级。
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Influence of valley splitting on spin relaxation time in a strained thin silicon film
The electron spin properties are promising for future spin-driven devices. In contrast to charge, spin is not a conserved quantity, and having sufficiently long spin lifetime is critical for applications. Silicon, the major material of microelectronics, also appears to be a perfect material for spintronic applications. The peculiarities of the subband structure and details of the spin propagation in ultra-thin silicon films in the presence of strain are investigated. The application of an uniaxial stress can lift the degeneracy between the remaining two valleys in a (001) silicon film. The [001] equivalent valley coupling through the Γ-point, which results in a subband splitting in a confined relaxed electron structure, is properly included. Its impact on the shear strain inflicted equivalent subband splitting is evaluated, and thereby the dependence of spin lifetime on the valley splitting is predicted. In all possible conditions, the spin lifetime is observed to be boosted by several orders of magnitude.
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