老化模型对深度缩放三栅极技术的挑战

S. Ramey, Y. Lu, I. Meric, S. Mudanai, S. Novak, C. Prasad, J. Hicks
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引用次数: 14

摘要

随着三栅极晶体管技术不断向更小的尺寸扩展,各种老化机制对于包括在模型中以准确预测晶体管寿命终止性能变得非常重要。传统的老化效应如BTI和热载体继续发挥作用。然而,随着恢复、变化和局部自热的加入,这些机制的建模变得更加复杂。此外,二阶效应开始累积,如恢复相互作用、少数载流子栅极注入、损伤局部化以及热载流子与BTI之间的相互作用。这项工作强调了这些不同影响的作用和影响,以及它们如何需要适应一个全面的老龄化模型。
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Aging model challenges in deeply scaled tri-gate technologies
As tri-gate transistor technologies continue to scale to smaller dimensions, a variety of aging mechanisms become important to include in models to accurately predict end-of-life transistor performance. Traditional aging effects such as BTI and hot carrier continue to play a role. However, modeling these mechanisms becomes more complicated with the addition of recovery, variation, and local self-heating. Further, second-order effects are starting to accumulate, such as recovery interactions, minority carrier gate injection, damage localization, and interactions between hot carrier and BTI. This work highlights the roles and impacts of these various effects and how they will need to fit into a comprehensive aging model.
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