微投影仪显示用热化接近耦合(APC)合成绿色激光光电封装设计:数值模拟与实验

S. Chaparala, V. Bhagavatula, J. Himmelreich
{"title":"微投影仪显示用热化接近耦合(APC)合成绿色激光光电封装设计:数值模拟与实验","authors":"S. Chaparala, V. Bhagavatula, J. Himmelreich","doi":"10.1109/ESIME.2011.5765761","DOIUrl":null,"url":null,"abstract":"Micro-projector based displays are proposed for information display for a number of consumer devices. These displays would provide larger images than existing fixed Liquid crystal displays. The two major components of micro-projector technology are the Light source and the Imaging technology. Three primary colors, red, blue and green are required to create full color images. The light sources in the projection technology would be semiconductor devices that emit these colors. These devices could be either light emitting diodes (LEDs) or lasers. To enable the laser based projection technology, red and blue lasers are commerically available. Native semiconductor green lasers are still in development. As an alternative, synthetic green light can be produced by passing 1060nm infra-red light emitted from a GaAs based semiconductor laser diode (LD) through second harmonic generation (SHG) crystal, thereby emitting the green light at 530 nm. The current research work proposes bringing the SHG structure in close proximity to the LD, thereby eliminating the use of any optics in between. The proximity coupling approach promises to reduce the number of package components and process cost significantly. This paper presents the mechanical package design, coefficient of thermal expansion based displacement estimates, thermal analysis wherein the thermal impedance is predicted and measured, thermo-mechanical analysis wherein the thermo-mechanical stresses and strains are predicted. Shock modeling has been done to understand the displacements of the waveguides during the shock event. Optical modeling is performed to estimate the coupling efficiency change as a function of lateral and longitudinal offset between the LD and SHG waveguides. Finally, an assembled package that generated green light using this design is presented.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design of athermalized proximity coupled (APC) synthetic green laser opto-electronic package for microprojector displays: Numerical modeling and experiments\",\"authors\":\"S. Chaparala, V. Bhagavatula, J. Himmelreich\",\"doi\":\"10.1109/ESIME.2011.5765761\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Micro-projector based displays are proposed for information display for a number of consumer devices. These displays would provide larger images than existing fixed Liquid crystal displays. The two major components of micro-projector technology are the Light source and the Imaging technology. Three primary colors, red, blue and green are required to create full color images. The light sources in the projection technology would be semiconductor devices that emit these colors. These devices could be either light emitting diodes (LEDs) or lasers. To enable the laser based projection technology, red and blue lasers are commerically available. Native semiconductor green lasers are still in development. As an alternative, synthetic green light can be produced by passing 1060nm infra-red light emitted from a GaAs based semiconductor laser diode (LD) through second harmonic generation (SHG) crystal, thereby emitting the green light at 530 nm. The current research work proposes bringing the SHG structure in close proximity to the LD, thereby eliminating the use of any optics in between. The proximity coupling approach promises to reduce the number of package components and process cost significantly. This paper presents the mechanical package design, coefficient of thermal expansion based displacement estimates, thermal analysis wherein the thermal impedance is predicted and measured, thermo-mechanical analysis wherein the thermo-mechanical stresses and strains are predicted. Shock modeling has been done to understand the displacements of the waveguides during the shock event. Optical modeling is performed to estimate the coupling efficiency change as a function of lateral and longitudinal offset between the LD and SHG waveguides. Finally, an assembled package that generated green light using this design is presented.\",\"PeriodicalId\":115489,\"journal\":{\"name\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-04-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2011.5765761\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2011.5765761","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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摘要

基于微型投影仪的显示器被提出用于许多消费设备的信息显示。这些显示器将比现有的固定液晶显示器提供更大的图像。微型投影仪技术的两个主要组成部分是光源和成像技术。三种原色,红色,蓝色和绿色需要创建全彩色图像。投影技术中的光源将是发射这些颜色的半导体设备。这些装置可以是发光二极管(led)或激光器。为了实现基于激光的投影技术,红色和蓝色激光器已经商业化。本土半导体绿色激光器仍在发展中。作为一种替代方案,可以将GaAs基半导体激光二极管(LD)发出的1060nm红外光通过二次谐波产生(SHG)晶体,从而发出530 nm的绿光,从而产生合成绿光。目前的研究工作建议将SHG结构靠近LD,从而消除在两者之间使用任何光学器件。接近耦合方法有望显著减少封装组件的数量和工艺成本。本文介绍了机械封装设计、基于位移估计的热膨胀系数、热分析(其中预测和测量热阻抗)、热力学分析(其中预测热力学应力和应变)。为了了解在激波事件中波导的位移,我们进行了激波建模。通过光学建模来估计耦合效率随LD和SHG波导横向和纵向偏移量的变化。最后,给出了一个使用该设计产生绿光的组装封装。
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Design of athermalized proximity coupled (APC) synthetic green laser opto-electronic package for microprojector displays: Numerical modeling and experiments
Micro-projector based displays are proposed for information display for a number of consumer devices. These displays would provide larger images than existing fixed Liquid crystal displays. The two major components of micro-projector technology are the Light source and the Imaging technology. Three primary colors, red, blue and green are required to create full color images. The light sources in the projection technology would be semiconductor devices that emit these colors. These devices could be either light emitting diodes (LEDs) or lasers. To enable the laser based projection technology, red and blue lasers are commerically available. Native semiconductor green lasers are still in development. As an alternative, synthetic green light can be produced by passing 1060nm infra-red light emitted from a GaAs based semiconductor laser diode (LD) through second harmonic generation (SHG) crystal, thereby emitting the green light at 530 nm. The current research work proposes bringing the SHG structure in close proximity to the LD, thereby eliminating the use of any optics in between. The proximity coupling approach promises to reduce the number of package components and process cost significantly. This paper presents the mechanical package design, coefficient of thermal expansion based displacement estimates, thermal analysis wherein the thermal impedance is predicted and measured, thermo-mechanical analysis wherein the thermo-mechanical stresses and strains are predicted. Shock modeling has been done to understand the displacements of the waveguides during the shock event. Optical modeling is performed to estimate the coupling efficiency change as a function of lateral and longitudinal offset between the LD and SHG waveguides. Finally, an assembled package that generated green light using this design is presented.
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