Air-stable Cu complex inks for printed electronics with high conductivity and high reliability

In this work, two kinds of photonic sintering methods: laser sintering and intense pulsed light sintering are used to sinter air-stable Cu complex inks and achieve dense microstructures of Cu patterns. It is found that the microstructure of sintered Cu patterns from Cu complex inks is highly depended on the removal process of organic matter during the decomposition process. It is difficult to achieve dense and uniform microstructure of Cu pattern by using photonic sintering because of the rapid evaporation of organic matter. The introduction of the low-temperature pre-curing process before photonic sintering can drive the decomposition of Cu complex in a mild way and realize a uniform structure of Cu patterns. The subsequent intense pulsed light can further drive the sintering of Cu patterns to form a highly dense and uniform microstructure of Cu patterns and achieve high conductivity and reliability.