高密度存储系统的单相浸没冷却研究

S. Karajgikar, Jasper Kidger, A. Shaw, N. Edmunds, V. Mulay
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摘要

在本文中,重新设计了一个标准的风冷高密度存储系统,以演示单相浸没冷却的使用。存储系统主要由72个硬盘、2个单插槽节点、2个SAS扩展卡、网卡和一块配电板组成,外形为4OU。成功地证明了该存储系统可以设计成支持单相浸入式冷却,同时像风冷系统一样支持热插拔和冷却冗余要求。在风冷系统中,驱动器之间的温度梯度高达19°C。放置在系统前部的驱动器接收较冷的空气,而放置在后部的驱动器接收预热空气,从而产生温度梯度。用于研究的驱动器是20GB的氦气密封驱动器。对于浸入式冷却,72个驱动器并联冷却,温度变化小于3°C。其他系统组件如CPU、dimm、SAS芯片和NIC有足够的热裕度。实验结果表明,该系统可以在40℃的温度下可靠运行。由此产生的泵的功耗不到IT总功耗的5%。此外,所提出的冷却解决方案可能有助于减轻空气冷却解决方案中经常遇到的驱动器的声学振动问题。该解决方案在运行中几乎是无声的。
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Single-Phase Immersion Cooling Study of a High-Density Storage System
In this paper, a standard air-cooled high-density storage system is reengineered to demonstrate the use of single-phase immersion cooling. The storage system consists primarily of seventy-two hard drives, two single socket nodes, two SAS expander cards, NIC and a power distribution board in a 4OU form factor. It is successfully demonstrated that the storage systems can be designed to support single phase immersion cooling while supporting hot swap and cooling redundancy requirement like an air-cooled system. In an air-cooled system, temperature gradient between the drives was as high as 19°C. The drives placed at the front of the system received cooler air while the drives placed in the rear received preheated air thus resulting in a temperature gradient. The drives used for the study were 20GB Helium filled sealed drives. For immersion cooling, seventy-two drives were cooled in parallel with temperature variance of less than 3°C. The other system components such as CPU, DIMMs, SAS chip and NIC had sufficient thermal margin. It was demonstrated that the system can operate reliably for facility coolant supply temperature as high as 40°C. The resulting power consumption of the pump was less than five percent of the total IT power. In addition, the proposed cooling solution may help mitigate acoustic vibrational issues for drives often encountered in air-cooling solution. The solution is virtually silent in operation.
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