优化双栅MISHEMTs的栅极氧化物以提高直流性能

Preeti Singh, V. Kumari, M. Saxena, Mridula Gupta
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引用次数: 4

摘要

本文对高k栅极介电介质对双栅MISHEMTs直流性能的影响进行了仿真研究。对$\ mathm {S}\ mathm {i} {3}\ mathm {N}{4}、$ mathm {A}1_{2}\ mathm {O}{3}、\ mathm {H}\ mathm {f}\ mathm {O}}、\ mathm {A}1_{2}、\ mathm {S}\ mathm {i} {3}\ mathm {N}{4}、\ mathm {H}\ mathm {O} {2}/\ mathm {S}\ mathm {i} {3}\ mathm {N}{2}和$\ mathm {H}\ mathm {i} {2}/\ mathm {A}1_{2}、$ mathm {H}\ mathm {O}}进行了比较。如果界面电荷密度从$4.6\乘以10^{12}\ mathm {c}\ mathm {m}}^{-2}$到$8\乘以10^{12}\ mathm {c}\ mathm {m}}^{-2}$,观察到DG-MISHEMT的$\ mathm {H}\ mathm {O}}$的阈值电压位移为10.6%,与$\ mathm {A}1_{2}\ mathm {O}} {3}/\ mathm {S}} {i} {3}\ mathm {N}{4}$或$\ mathm {H}\ mathm {f}\ mathm相比,这种位移最小{O} _ {2} / \ mathrm{年代}\ mathrm{我}_ {3}\ mathrm {N} _{4} $。此外,阈值电压的变化与不同的堆叠厚度变化无关。利用SILVACO TCAD工具的ATLAS模块在常温下进行了仿真。
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Optimization of Gate Oxide of Dual-Gate MISHEMTs for Enhanced DC performance
In this paper, simulation study has been carried out to evaluate the impact of high-k gate dielectric on DC performance of Dual-Gate MISHEMTs. Comparison of different gate dielectrics and gate stacks such as $\mathrm {S}\mathrm {i}_{3}\mathrm {N}_{4}, \mathrm {A}1_{2}\mathrm {O}_{3}, \mathrm {H}\mathrm {f}\mathrm {O}_{2}, \mathrm {A}1_{2}\mathrm {O}_{3}/\mathrm {S}\mathrm {i}_{3}\mathrm {N}_{4}, \mathrm {H}\mathrm {f}\mathrm {O}_{2}/\mathrm {S}\mathrm {i}_{3}\mathrm {N}_{4}$ and $\mathrm {H}\mathrm {f}\mathrm {O}_{2}/\mathrm {A}1_{2}\mathrm {O}_{3}$ has been presented. Threshold voltage shift of 10.6% has been observed for $\mathrm {H}\mathrm {f}\mathrm {O}_{2}/\mathrm {A}1_{2}\mathrm {O}_{3}$ gate dielectric stack for DG-MISHEMT if interface charge density were varied from $4.6\times 10^{12}\mathrm {c}\mathrm {m}^{-2}$ to $8\times 10^{12}\mathrm {c}\mathrm {m}^{-2}$ and this shift is minimum as compared to other gate stacks combinations like $\mathrm {A}1_{2}\mathrm {O}_{3}/\mathrm {S}\mathrm {i}_{3}\mathrm {N}_{4}$ or $\mathrm {H}\mathrm {f}\mathrm {O}_{2}/\mathrm {S}\mathrm {i}_{3}\mathrm {N}_{4}$. Also, threshold voltage change is marginal with different stack thickness variation. Simulations were carried out using ATLAS module of SILVACO TCAD tool at ambient temperature.
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